Datasheet

© 2011 Microchip Technology Inc. DS61143H-page 213
PIC32MX3XX/4XX
Product Identification System
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Architecture MX = 32-bit RISC MCU core
Product Groups 3XX= General purpose microcontroller family
4XX= USB
Flash Memory Family F = Flash program memory
Program Memory Size 32 = 32K
64 = 64K
128 = 128K
256 = 256K
512 = 512K
Speed 40 = 40 MHz
80 = 80 MHz
Pin Count H = 64-pin
L = 100-pin
Temperature Range I = -40° C to +85° C (Industrial)
V= -40° C to +105° C (V-Temp)
Package PT = 64-Lead (10x10x1 mm) TQFP (Thin Quad Flatpack)
PT = 100-Lead (12x12x1 mm) TQFP (Thin Quad Flatpack)
MR = 64-Lead (9x9x0.9 mm) QFN (Plastic Quad Flat)
BG = 121-Lead (10x10x1.1 mm) XBGA (Plastic Thin Profile Ball Grid Array)
Pattern Three-digit QTP, SQTP, Code or Special Requirements (blank otherwise)
ES = Engineering Sample
Examples:
PIC32MX320F032H-40I/PT:
General purpose PIC32MX,
32 KB program memory,
64-pin, Industrial temperature,
TQFP package.
PIC32MX360F256L-80I/PT:
General purpose PIC32MX,
256 KB program memory,
100-pin, Industrial temperature,
TQFP package.
Microchip Brand
Architecture
Flash Memory Family
Pin Count
Product Groups
Program Memory Size (KB)
PIC32
MX 3XX F 512 H T -80 I /PT- XXX
Flash Memory Family
Speed
Pattern
Package
Temperature Range
Tape and Reel Flag (if applicable)