Datasheet

 2009-2012 Microchip Technology Inc. DS70593D-page 343
dsPIC33FJXXXGPX06A/X08A/X10A
100-Lead Plastic Thin Quad Flatpack (PT) – 12x12x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Leads N 100
Lead Pitch e 0.40 BSC
Overall Height A – – 1.20
Molded Package Thickness A2 0.95 1.00 1.05
Standoff A1 0.05 – 0.15
Foot Length L 0.45 0.60 0.75
Footprint L1 1.00 REF
Foot Angle φ 0° 3.5° 7°
Overall Width E 14.00 BSC
Overall Length D 14.00 BSC
Molded Package Width E1 12.00 BSC
Molded Package Length D1 12.00 BSC
Lead Thickness c 0.09 – 0.20
Lead Width b 0.13 0.18 0.23
Mold Draft Angle Top α 11° 12° 13°
Mold Draft Angle Bottom β 11° 12° 13°
D
D1
E
E1
e
b
N
123
NOTE 1
NOTE 2
c
L
A1
L1
A
A2
α
β
φ
Microchip Technology Drawing C04-100B