Datasheet

dsPIC33FJXXXGPX06A/X08A/X10A
DS70593D-page 322  2009-2012 Microchip Technology Inc.
26.1 High Temperature DC Characteristics
TABLE 26-1: OPERATING MIPS VS. VOLTAGE
TABLE 26-2: THERMAL OPERATING CONDITIONS
TABLE 26-3: DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
TABLE 26-4: DC CHARACTERISTICS: POWER-DOWN CURRENT (I
PD)
Characteristic
V
DD Range
(in Volts)
Temperature Range
(in °C)
Max MIPS
dsPIC33FJXXXGPX06A/X08A/X10A
HDC5 V
BOR to 3.6V
(1)
-40°C to +150°C 20
Note 1: Device is functional at VBORMIN < VDD < VDDMIN. Analog modules such as the ADC will have degraded
performance. Device functionality is tested but not characterized. Refer to parameter BO10 in Tab le 25-11
for the minimum and maximum BOR values.
Rating Symbol Min Typ Max Unit
High Temperature Devices
Operating Junction Temperature Range TJ -40 — +155 °C
Operating Ambient Temperature Range TA -40 — +150 °C
Power Dissipation:
Internal chip power dissipation:
P
INT = VDD x (IDD -  IOH)
PD PINT + PI/O W
I/O Pin Power Dissipation:
I/O =  ({V
DD - VOH} x IOH) +  (VOL x IOL)
Maximum Allowed Power Dissipation PDMAX (TJ - TA)/JA W
DC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +150°C for High Temperature
Parameter
No.
Symbol Characteristic Min Typ Max Units Conditions
Operating Voltage
HDC10 Supply Voltage
V
DD — 3.0 3.3 3.6 V -40°C to +150°C
DC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +150°C for High Temperature
Parameter
No.
Typical Max Units Conditions
Power-Down Current (I
PD)
HDC60e 250 2000 A +150°C 3.3V Base Power-Down Current
(1,3)
Note 1: Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and
pulled to V
SS. WDT, etc., are all switched off, and VREGS (RCON<8>) = 1.
2: The  current is the additional current consumed when the module is enabled. This current should be
added to the base I
PD current.
3: These currents are measured on the device containing the most memory in this family.
4: These parameters are characterized, but are not tested in manufacturing.