Datasheet

dsPIC33FJXXXGPX06A/X08A/X10A
DS70593D-page 272  2009-2012 Microchip Technology Inc.
25.1 DC Characteristics
TABLE 25-1: OPERATING MIPS VS. VOLTAGE
Characteristic
V
DD Range
(in Volts)
Temp Range
(in °C)
Max MIPS
dsPIC33FJXXXGPX06A/X08A/X10A
—
V
BOR-3.6V
(1)
-40°C to +85°C 40
—
V
BOR-3.6V
(1)
-40°C to +125°C 40
Note 1: Device is functional at V
BORMIN < VDD < VDDMIN. Analog modules such as the ADC will have degraded
performance. Device functionality is tested but not characterized. Refer to parameter BO10 in Ta ble 2 5 - 11
for the minimum and maximum BOR values.
TABLE 25-2: THERMAL OPERATING CONDITIONS
Rating Symbol Min Typ Max Unit
dsPIC33FJXXXGPX06A/X08A/X10A
Operating Junction Temperature Range TJ -40 — +125 °C
Operating Ambient Temperature Range TA -40 — +85 °C
Extended Temperature Devices
Operating Junction Temperature Range T
J -40 — +150 °C
Operating Ambient Temperature Range TA -40 — +125 °C
Power Dissipation:
Internal chip power dissipation:
PINT = VDD x (IDD -  IOH)
PD PINT + PI/O W
I/O Pin Power Dissipation:
I/O =  ({V
DD - VOH} x IOH) +  (VOL x IOL)
Maximum Allowed Power Dissipation PDMAX (TJ - TA)/JA W
TABLE 25-3: THERMAL PACKAGING CHARACTERISTICS
Characteristic Symbol Typ Max Unit Notes
Package Thermal Resistance, 100-pin TQFP (14x14x1 mm) JA 40 — °C/W 1
Package Thermal Resistance, 100-pin TQFP (12x12x1 mm) JA 40 — °C/W 1
Package Thermal Resistance, 80-pin TQFP (12x12x1 mm)
JA 40 — °C/W 1
Package Thermal Resistance, 64-pin TQFP (10x10x1 mm)
JA 40 — °C/W 1
Package Thermal Resistance, 64-pin QFN (9x9x0.9 mm)
JA 28 — °C/W 1
Note 1: Junction to ambient thermal resistance, Theta-
JA (JA) numbers are achieved by package simulations.