Datasheet

dsPIC33EPXXX(GP/MC/MU)806/810/814 and PIC24EPXXX(GP/GU)810/814
DS70616F-page 574 Preliminary © 2009-2012 Microchip Technology Inc.
34.1 Package Marking Information (Continued)
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
* This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
144-Lead TQFP (16x16x1 mm)
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
Example
dsPIC33EP256
MU814-I/PH
0510017
3
e
121-Lead TFBGA (10x10x1.2 mm) Example
144-Lead LQFP (20x20x1.4 mm)
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
Example
dsPIC33EP256
MU814-I/PL
0510017
3
e
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
33EP256MU
810-I/BG
0610017
3
e