Datasheet

© 2009-2012 Microchip Technology Inc. Preliminary DS70616F-page 573
dsPIC33EPXXX(GP/MC/MU)806/810/814 and PIC24EPXXX(GP/GU)810/814
34.0 PACKAGING INFORMATION
34.1 Package Marking Information
64-Lead TQFP (10x10x1 mm)
XXXXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
Example
dsPIC33EP
256MU806
0510017
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
* This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
-I/PT
3
e
64-Lead QFN (9x9x0.9 mm) Example
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
33EP256MU
806-I/MR
0610017
3
e
100-Lead TQFP (12x12x1 mm)
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
Example
dsPIC33EP256
MU810-I/PT
0510017
3
e
100-Lead TQFP (14x14x1 mm)
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
Example
dsPIC33EP256
MU810-I/PF
0510017
3
e