Datasheet

dsPIC33EPXXX(GP/MC/MU)806/810/814 and PIC24EPXXX(GP/GU)810/814
DS70616F-page 496 Preliminary © 2009-2012 Microchip Technology Inc.
32.1 DC Characteristics
TABLE 32-1: OPERATING MIPS VS. VOLTAGE
Characteristic
V
DD Range
(in Volts)
Temp Range
(in °C)
Maximum MIPS
dsPIC33EPXXX(GP/MC/MU)806/810/
814 and PIC24EPXXX(GP/GU)810/814
— 2.95V-3.6V
(1)
-40°C to +85°C 70
— 2.95V-3.6V
(1)
-40°C to +125°C 60
Note 1: Device is functional at VBORMIN < VDD < VDDMIN. Analog modules: ADC, Comparator, and DAC will have
degraded performance. Device functionality is tested but not characterized. Refer to parameter BO10 in
Table 32-11 for the minimum and maximum BOR values.
TABLE 32-2: THERMAL OPERATING CONDITIONS
Rating Symbol Min. Typ. Max. Unit
Industrial Temperature Devices
Operating Junction Temperature Range T
J -40 — +125 °C
Operating Ambient Temperature Range T
A -40 — +85 °C
Extended Temperature Devices
Operating Junction Temperature Range T
J -40 — +140 °C
Operating Ambient Temperature Range T
A -40 — +125 °C
Power Dissipation:
Internal chip power dissipation:
PINT = VDD x (IDD – Σ IOH)
P
D PINT + PI/O W
I/O Pin Power Dissipation:
I/O = Σ ({V
DD – VOH} x IOH) + Σ (VOL x IOL)
Maximum Allowed Power Dissipation P
DMAX (TJ – TA)/θJA W
TABLE 32-3: THERMAL PACKAGING CHARACTERISTICS
Characteristic Symbol Typ. Max. Unit Notes
Package Thermal Resistance, 64-pin QFN (9x9 mm)
θJA 28 — °C/W 1
Package Thermal Resistance, 64-pin TQFP (10x10 mm)
θJA 47 — °C/W 1
Package Thermal Resistance, 100-pin TQFP (12x12 mm)
θJA 43 — °C/W 1
Package Thermal Resistance, 100-pin TQFP (14x14 mm)
θJA 43 — °C/W 1
Package Thermal Resistance, 121-pin TFBGA (10x10 mm)
θJA 40 — °C/W 1
Package Thermal Resistance, 144-pin LQFP (20x20 mm)
θJA 33 — °C/W 1
Package Thermal Resistance, 144-pin TQFP (16x16 mm) θJA 33 — °C/W 1
Note 1: Junction to ambient thermal resistance, Theta-
JA (θJA) numbers are achieved by package simulations.