Datasheet

ManualsBrandsMIKROELEKTRONIKA ManualsMikroElektronika Development KitsPCB extension board

241

242

243

244

245

246

247

248

249

250

PIC32MX5XX/6XX/7XX

4.0 “Memory Organization” Updated all register tables to include the Virtual Address and All Resets

columns.

Updated the title of Figure 4-4 to include the PIC32MX575F256L device.

Updated the title of Figure 4-6 to include the PIC32MX695F512L and

PIC32MX695F512H devices. Also changed PIC32MX795F512L to

PIC32MX795F512

Updated the title of Tab l e 4 - 3 to include the PIC32MX695F512H device.

Updated the title of Tab l e 4 - 5 to include the PIC32MX575F5256L device.

Updated the title of Tab l e 4 - 6 to include the PIC32MX695F512L device.

Reversed the order of Ta bl e 4 -11 and Table 4-12.

Reversed the order of Ta bl e 4 -1 4 and Ta ble 4- 1 5.

Updated the title of Tab l e 4 - 15 to include the PIC32MX575F256L and

PIC32MX695F512L devices.

Updated the title of Tab l e 4 - 45 to include the PIC32MX575F256L device.

Updated the title of Tab l e 4 - 47 to include the PIC32MX695F512H and

PIC32MX695F512L devices.

12.0 “I/O Ports” Updated the second paragraph of 12.1.2 “Digital Inputs” and removed Table

12-1.

22.0 “10-bit Analog-to-Digital

Converter (ADC)”

Updated the ADC Conversion Clock Period Block Diagram (see Figure 22-2).

28.0 “Special Features” Removed references to the ENVREG pin in 28.3 “On-Chip Voltage

Regulator”.

Updated the first sentence of

28.3.1 “On-Chip Regulator and POR” and

28.3.2 “On-Chip Regulator and BOR”.

Updated the Connections for the On-Chip Regulator (see Figure 28-2).

31.0 “Electrical Characteristics” Updated the Absolute Maximum Ratings and added Note 3.

Added Thermal Packaging Characteristics for the 121-pin XBGA package

(see Table 31-3).

Updated the Operating Current (I

DD) DC Characteristics (see Ta ble 3 1 - 5 ).

Updated the Idle Current (I

IDLE) DC Characteristics (see Table 31-6).

Updated the Power-Down Current (I

PD) DC Characteristics (see Table 31-7).

Removed Note 1 from the Program Flash Memory Wait State Characteristics

(see Table 31-12).

Updated the SPIx Module Slave Mode (CKE =

1) Timing Characteristics,

changing SP52 to SP35 between the MSb and Bit 14 on SDOx (see

Figure 31-13).

32.0 “Packaging Information” Added the 121-pin XBGA package marking information and package details.

“Product Identification System” Added the definition for BG (121-lead 10x10x1.1 mm, XBGA).

Added the definition for Speed.

TABLE B-1: MAJOR SECTION UPDATES (CONTINUED)

Section Name Update Description