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DocID022152 Rev 4 159/185
STM32F405xx, STM32F407xx Package characteristics
Figure 76. WLCSP90 - 0.400 mm pitch wafer level chip size package outline
Bump side
Side view
Detail A
Wafer back side
A1 ball location
A1
Detail A
rotated by 90 °C
eee
D
A0JW_ME
Seating plane
A2
A
b
E
e
e1
e
G
F
e2
Table 90. WLCSP90 - 0.400 mm pitch wafer level chip size package mechanical data
Symbol
millimeters inches
(1)
Min Typ Max Min Typ Max
A 0.520 0.570 0.620 0.0205 0.0224 0.0244
A1 0.165 0.190 0.215 0.0065 0.0075 0.0085
A2 0.350 0.380 0.410 0.0138 0.015 0.0161
b 0.240 0.270 0.300 0.0094 0.0106 0.0118
D 4.178 4.218 4.258 0.1645 0.1661 0.1676
E 3.964 3.969 4.004 0.1561 0.1563 0.1576
e 0.400 0.0157
e1 3.600 0.1417
e2 3.200 0.126
F 0.312 0.0123
G 0.385 0.0152
eee 0.050 0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.