Information

DocID15818 Rev 11 177/178
STM32F20xxx Revision history
177
04-Nov-2013
11
(continued)
Removed Appendix A Application block diagrams.
Updated Figure 76: LQFP64 – 10 x 10 mm 64 pin low-profile quad flat
package outline and Table 87: LQFP64 – 10 x 10 mm 64 pin low-
profile quad flat package mechanical data. Updated Figure 79:
LQFP100, 14 x 14 mm 100-pin low-profile quad flat package outline,
Figure 81: LQFP144, 20 x 20 mm, 144-pin low-profile quad flat
package outline, Figure 83: LQFP176 - Low profile quad flat package
24 × 24 × 1.4 mm, package outline. Updated Figure 85:
UFBGA176+25 - ultra thin fine pitch ball grid array 10 × 10 × 0.6 mm,
package outline and Figure 85: UFBGA176+25 - ultra thin fine pitch
ball grid array 10 × 10 × 0.6 mm, package outline.
Table 95. Document revision history (continued)
Date Revision Changes