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DocID15818 Rev 11 153/178
STM32F20xxx Package characteristics
177
Figure 78. WLCSP64+2 - 0.400 mm pitch wafer level chip size package outline
1. Drawing is not to scale.
Bump sideSide view
Detail A
Wafer back side
A1 ball location
A1
Detail A
rotated by 90 °C
eee
D
A0FX_ME
Seating plane
A2
A
b
E
e
e1
e
G
F
e1
Table 88. WLCSP64+2 - 0.400 mm pitch wafer level chip size package mechanical data
Symbol
millimeters inches
Min Typ Max Min Typ Max
A 0.520 0.570 0.600 0.0205 0.0224 0.0236
A1 0.170 0.190 0.210 0.0067 0.0075 0.0083
A2 0.350 0.380 0.410 0.0138 0.0150 0.0161
b 0.245 0.270 0.295 0.0096 0.0106 0.0116
D 3.619 3.639 3.659 0.1425 0.1433 0.1441
E 3.951 3.971 3.991 0.1556 0.1563 0.1571
e - 0.400 - - 0.0157 -
e1 - 3.218 - - 0.1267 -
F - 0.220 - - 0.0087 -