User Manual

Wireless Platforms
CM/BU 5 (10)
RD-1/RD-2 handling guidelines for OEMs Print Date: 1/15/2007 Copyright © 2007 Nokia.
The module should only be removed from the clamshell package directly before insertion into the host laptop.
Before opening the packaging the correct orientation of the package top side must be checked and set from the
package markings. The packaging is opened by placing the thumb in bottom of package bevelled slot, located each
corners in package cover, and gently prising package cover and bottom off using the other thumb. This process
should be repeated for the opposite corner. Once two or more corners from the package coverage have been freed
from the package bottom the cover of the package can be removed. The package cover should be place to one
side. The module is removed from the package by gripping the corner with the PWB hole between the thumb and
forefinger and lifting module gently off from the package. The module should then be held prior to installation in
accordance with the General Handling guidance given in paragraph 4.2
*Figures 1 and 2 are intended to be representative of the packaging discussed and should not be considered as constituting a description of the
actual module(s) and/or packaging delivered.
5 Handling
5.1 General Handling
PCI Express Mini Card circuit boards are significantly thinner than standard PC motherboards. A consequence of
this is that solder joints on the PCI Express Mini Card circuit boards are more susceptible to cracking and damage
resulting from bowing and flexing of the circuit board material during handling. Accordingly the RD-1/RD-2 WWAN
module should be treated with significantly more care to avoid damage.
The module should not be intentionally bent along any axis. When inserting the module into the host PC pressure
should only be applied along the axes and at the points prescribed in this document.
The module should be lightly gripped between the thumb and forefinger of the same hand touching only the edge
areas shown below in red.
Figure 3: Safe module gripping areas highlighted in red and diagonal lines