User Manual

LRB-1 Nokia Bluetooth Tranceiver Component
- Preliminary Information -


April 2001 Confidential 5/11
Functional Description
A. Key Components
The LRB-1 Nokia Bluetooth Transceiver Component consists of three integrated circuits plus a couple of
smaller active and passive passive components. All three chips are using state-of-the-art semiconductor
technologies and are mounted on the MCM substrate using flip-chip techniques:
q Baseband ASIC:
This chip, running at 1.8 V is a pure CMOS ASIC including the ARM7TDMIE microcontroller core,
embedded RAMs and the core logic for MIPS consuming Bluetooth tasks. Due to the fact that only
the MIPS consuming tasks are realized in hardware and that a central buffer RAM instead of
dedicated connection buffers are used, this approach has been proven to be flexible and future-proof.
q Radio ASIC:
The radio chip in BiCMOS technology works as the transceiver chip for the ISM band of 2400-2483
MHz which is used for Bluetooth transmission. Implemented on-chip function blocks include the PLL,
LNA, mixer and Gaussian modulator as well as 13 MHz crystal oscillator and all neded voltage
regulators.
q
Flash Memory:
An industry-standard 16-bit wide 2 MBit Flash memory running at 1.8 V with an access time of 120
ns has been implemented on the LRB-1 module. Sectoring is used to allow also the storage of non-
volatile configuration information (e.g. BD address) on the device.