Datasheet
Table Of Contents
- 1.0 Introduction
- 2.0 USB3320 Pin Locations and Definitions
- 3.0 Limiting Values
- 4.0 Electrical Characteristics
- 4.1 Operating Current
- 4.2 Clock Specifications
- 4.3 ULPI Interface Timing
- 4.4 Digital IO Pins
- 4.5 DC Characteristics: Analog I/O Pins
- 4.6 Dynamic Characteristics: Analog I/O Pins
- 4.7 OTG Electrical Characteristics
- 4.8 USB Audio Switch Characteristics
- 4.9 Regulator Output Voltages and Capacitor Requirement
- 4.10 Piezoelectric Resonator for Internal Oscillator
- 5.0 Architecture Overview
- FIGURE 5-1: USB3320 Internal Block Diagram
- 5.1 ULPI Digital Operation and Interface
- 5.2 USB 2.0 Hi-Speed Transceiver
- 5.3 Bias Generator
- 5.4 Integrated Low Jitter PLL
- 5.5 Internal Regulators and POR
- 5.6 USB On-The-Go (OTG)
- 5.7 USB UART Support
- 5.8 USB Charger Detection Support
- 5.9 USB Audio Support
- 5.10 Reference Frequency Selection
- 6.0 ULPI Operation
- 6.1 Overview
- 6.2 ULPI Register Access
- 6.3 Low Power Mode
- 6.4 Full Speed/Low Speed Serial Modes
- 6.5 Carkit Mode
- 6.6 RID Converter Operation
- 6.7 Headset Audio Mode
- 7.0 ULPI Register Map
- 8.0 Application Notes
- 8.1 Application Diagram
- TABLE 8-1: Component Values in Application Diagrams
- TABLE 8-2: Capacitance Values at VBUS of USB Connector
- FIGURE 8-1: USB3320 Application Diagram (Device, ULPI Output Clock mode, 24MHz)
- FIGURE 8-2: USB3320 Application Diagram (Device, ULPI Input Clock mode, 60MHz)
- FIGURE 8-3: USB3320 Application Diagram (Host or OTG, ULPI Output Clock Mode, 24MHz)
- 8.2 Reference Designs
- 8.3 ESD Performance
- 8.1 Application Diagram
- 9.0 Package Information
- Appendix A: Data Sheet Revision History
- The Microchip Web Site
- Customer Change Notification Service
- Customer Support
- Product Identification System
- Worldwide Sales and Service

2014-2016 Microchip Technology Inc. DS00001792E-page 9
USB3320
3.0 LIMITING VALUES
3.1 Absolute Maximum Ratings
3.2 Recommended Operating Conditions
TABLE 3-1: ABSOLUTE MAXIMUM RATINGS
Parameter Symbol Condition MIN TYP MAX Units
VBUS, VBAT, ID, CPEN,
DP, DM, SPK_L, and
SPK_R voltage to GND
V
MAX_5V
Voltage measured at pin.
VBUS tolerant to 30V with
external R
VBUS
.
-0.5 +6.0 V
Maximum VDD18 voltage
to Ground
V
MAX_18V
-0.5 2.5 V
Maximum VDDIO voltage
to Ground
V
MAX_IOV
VDD18 = V
DD18
-0.5 4.0 V
Maximum VDDIO voltage
to Ground
V
MAX_IOV
VDD18 = 0V -0.5 0.7 V
Maximum VDD33 voltage
to Ground
V
MAX_33V
-0.5 4.0 V
Maximum I/O voltage to
Ground
V
MAX_IN
-0.5 V
DDIO
+ 0.7 V
Operating Temperature T
MAX_OP
-40 85 C
Storage Temperature T
MAX_STG
-55 150 C
Note: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
TABLE 3-2: RECOMMENDED OPERATING CONDITIONS
Parameter Symbol Condition MIN TYP MAX Units
VBAT to GND V
VBAT
3.1 5.5 V
VDD33 to GND V
DD33
3.0 3.3 3.6 V
VDDIO to GND V
DDIO
1.6 1.8-3.3 3.6 V
VDD18 to GND V
DD18
1.6 1.8 2.0 V
Input Voltage on Digital
Pins (RESETB, STP, DIR,
NXT, DATA[7:0])
V
I
0.0 V
DDIO
V
Voltage on Analog I/O
Pins (DP, DM, ID, CPEN,
SPK_L, SPK_R)
V
I(I/O)
0.0 V
DD33
V
VBUS to GND V
VMAX
0.0 5.5 V
Ambient Temperature T
A
-40 85 C
VDDIO VDD18 min