Datasheet
Table Of Contents
- 1.0 Introduction
- 2.0 USB3320 Pin Locations and Definitions
- 3.0 Limiting Values
- 4.0 Electrical Characteristics
- 4.1 Operating Current
- 4.2 Clock Specifications
- 4.3 ULPI Interface Timing
- 4.4 Digital IO Pins
- 4.5 DC Characteristics: Analog I/O Pins
- 4.6 Dynamic Characteristics: Analog I/O Pins
- 4.7 OTG Electrical Characteristics
- 4.8 USB Audio Switch Characteristics
- 4.9 Regulator Output Voltages and Capacitor Requirement
- 4.10 Piezoelectric Resonator for Internal Oscillator
- 5.0 Architecture Overview
- FIGURE 5-1: USB3320 Internal Block Diagram
- 5.1 ULPI Digital Operation and Interface
- 5.2 USB 2.0 Hi-Speed Transceiver
- 5.3 Bias Generator
- 5.4 Integrated Low Jitter PLL
- 5.5 Internal Regulators and POR
- 5.6 USB On-The-Go (OTG)
- 5.7 USB UART Support
- 5.8 USB Charger Detection Support
- 5.9 USB Audio Support
- 5.10 Reference Frequency Selection
- 6.0 ULPI Operation
- 6.1 Overview
- 6.2 ULPI Register Access
- 6.3 Low Power Mode
- 6.4 Full Speed/Low Speed Serial Modes
- 6.5 Carkit Mode
- 6.6 RID Converter Operation
- 6.7 Headset Audio Mode
- 7.0 ULPI Register Map
- 8.0 Application Notes
- 8.1 Application Diagram
- TABLE 8-1: Component Values in Application Diagrams
- TABLE 8-2: Capacitance Values at VBUS of USB Connector
- FIGURE 8-1: USB3320 Application Diagram (Device, ULPI Output Clock mode, 24MHz)
- FIGURE 8-2: USB3320 Application Diagram (Device, ULPI Input Clock mode, 60MHz)
- FIGURE 8-3: USB3320 Application Diagram (Host or OTG, ULPI Output Clock Mode, 24MHz)
- 8.2 Reference Designs
- 8.3 ESD Performance
- 8.1 Application Diagram
- 9.0 Package Information
- Appendix A: Data Sheet Revision History
- The Microchip Web Site
- Customer Change Notification Service
- Customer Support
- Product Identification System
- Worldwide Sales and Service
USB3320
DS00001792E-page 16 2014-2016 Microchip Technology Inc.
4.10 Piezoelectric Resonator for Internal Oscillator
The internal oscillator may be used with an external quartz crystal or ceramic resonator as described in Section 5.4.1.2.
See Table 4-11 for the recommended crystal specifications.
Note 4-10 The required bit rate accuracy for Hi-Speed USB applications is ±500 ppm as provided in the USB
2.0 Specification. This takes into account the effect of voltage, temperature, aging, etc.
Note 4-11 This number includes the pad, the bond wire and the lead frame. Printed Circuit Board (PCB)
capacitance is not included in this value. The PCB capacitance value and the capacitance value of
the XO and REFCLK pins are required to accurately calculate the value of the two external load
capacitors.
TABLE 4-11: USB3320 QUARTZ CRYSTAL SPECIFICATIONS
Parameter Symbol MIN TYP MAX Units Notes
Crystal Cut AT, typ
Crystal Oscillation Mode Fundamental Mode
Crystal Calibration Mode Parallel Resonant Mode
Frequency F
fund
- Table 5-10 -MHz
Total Allowable PPM Budget - - ±500 PPM Note 4-10
Shunt Capacitance C
O
-7 typ-pF
Load Capacitance C
L
- 20 typ - pF
Drive Level P
W
0.5 - - mW
Equivalent Series Resistance R
1
--30Ohm
Operating Temperature Range -40 - +85
o
C
USB3320 REFCLK Pin
Capacitance
-3 typ-pFNote 4-11
USB3320 XO Pin Capacitance - 3 typ - pF Note 4-11