Datasheet
Table Of Contents
- 12A High-Speed MOSFET Drivers
- Features
- Applications
- General Description
- Package Types
- Functional Block Diagram
- 1.0 Electrical Characteristics
- 2.0 Typical Performance Curves
- FIGURE 2-1: Rise Time vs. Supply Voltage
- FIGURE 2-2: Rise Time vs. Capacitive Load
- FIGURE 2-3: Fall Time vs. Supply Voltage
- FIGURE 2-4: Fall Time vs. Capacitive Load
- FIGURE 2-5: Rise and Fall Times vs. Temperature
- FIGURE 2-6: Crossover Energy vs. Supply Voltage
- FIGURE 2-7: Propagation Delay vs. Supply Voltage
- FIGURE 2-8: Propagation Delay vs. Input Amplitude
- FIGURE 2-9: Propagation Delay vs. Temperature
- FIGURE 2-10: Quiescent Supply Current vs. Supply Voltage
- FIGURE 2-11: Quiescent Supply Current vs. Temperature
- FIGURE 2-12: Input Threshold vs. Temperature
- FIGURE 2-13: Input Threshold vs. Supply Voltage
- FIGURE 2-14: High State Output Resistance vs. Supply Voltage
- FIGURE 2-15: Low State Output Resistance vs. Supply Voltage
- FIGURE 2-16: Supply Current vs. Capacitive Load (VDD = 18V)
- FIGURE 2-17: Supply Current vs. Capacitive Load (VDD = 12V)
- FIGURE 2-18: Supply Current vs. Capacitive Load (VDD = 6V)
- FIGURE 2-19: Supply Current vs. Frequency (VDD = 18V)
- FIGURE 2-20: Supply Current vs. Frequency (VDD = 12V)
- FIGURE 2-21: Supply Current vs. Frequency (VDD = 6V)
- 3.0 Pin Descriptions
- 4.0 Applications Information
- 5.0 Packaging Information
- Appendix A: Revision History
- Product Identification System
- Trademarks
- Worldwide Sales and Service
2006-2014 Microchip Technology Inc. DS20001987C-page 21
TC4451/TC4452
APPENDIX A: REVISION HISTORY
Revision C (July 2014)
The following is the list of modifications:
1. Added value for Electrostatic Discharge (ESD)
protection – Machine Model (MM) in General
Description: column.
2. Updated package marking information and
drawings in
Section 5.0, Packaging Information
.
3. Minor grammatical and spelling corrections.
Revision B (March 2012)
The following is the list of modifications:
1. Added V
DD
Ramp Rate value in both DC
Characteristics and DC Characteristics (Over
Operating Temperature Range) tables.
2. Updated package thermal resistances values in
Temperature Characteristics table.
3. Updated package specification drawings in
Section 5.0, Packaging Information to show
all available drawings.
Revision A (February 2006)
• Original release of this document.