Datasheet
Table Of Contents
- 12A High-Speed MOSFET Drivers
- Features
- Applications
- General Description
- Package Types
- Functional Block Diagram
- 1.0 Electrical Characteristics
- 2.0 Typical Performance Curves
- FIGURE 2-1: Rise Time vs. Supply Voltage
- FIGURE 2-2: Rise Time vs. Capacitive Load
- FIGURE 2-3: Fall Time vs. Supply Voltage
- FIGURE 2-4: Fall Time vs. Capacitive Load
- FIGURE 2-5: Rise and Fall Times vs. Temperature
- FIGURE 2-6: Crossover Energy vs. Supply Voltage
- FIGURE 2-7: Propagation Delay vs. Supply Voltage
- FIGURE 2-8: Propagation Delay vs. Input Amplitude
- FIGURE 2-9: Propagation Delay vs. Temperature
- FIGURE 2-10: Quiescent Supply Current vs. Supply Voltage
- FIGURE 2-11: Quiescent Supply Current vs. Temperature
- FIGURE 2-12: Input Threshold vs. Temperature
- FIGURE 2-13: Input Threshold vs. Supply Voltage
- FIGURE 2-14: High State Output Resistance vs. Supply Voltage
- FIGURE 2-15: Low State Output Resistance vs. Supply Voltage
- FIGURE 2-16: Supply Current vs. Capacitive Load (VDD = 18V)
- FIGURE 2-17: Supply Current vs. Capacitive Load (VDD = 12V)
- FIGURE 2-18: Supply Current vs. Capacitive Load (VDD = 6V)
- FIGURE 2-19: Supply Current vs. Frequency (VDD = 18V)
- FIGURE 2-20: Supply Current vs. Frequency (VDD = 12V)
- FIGURE 2-21: Supply Current vs. Frequency (VDD = 6V)
- 3.0 Pin Descriptions
- 4.0 Applications Information
- 5.0 Packaging Information
- Appendix A: Revision History
- Product Identification System
- Trademarks
- Worldwide Sales and Service
2006-2014 Microchip Technology Inc. DS20001987C-page 17
TC4451/TC4452
Microchip Technology Drawing No. C04-018D Sheet 2 of 2
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1RWH
/HDG3ODVWLF'XDO,Q/LQH3$PLO%RG\>3',3@
Units INCHES
Dimension Limits MIN NOM MAX
Number of Pins N 8
Pitch
e
.100 BSC
Top to Seating Plane A - - .210
Molded Package Thickness A2 .115 .130 .195
Base to Seating Plane A1 .015
Shoulder to Shoulder Width E .290 .310 .325
Molded Package Width E1 .240 .250 .280
Overall Length D .348 .365 .400
Tip to Seating Plane L .115 .130 .150
Lead Thickness
c
.008 .010 .015
Upper Lead Width b1 .040 .060 .070
Lower Lead Width
b
.014 .018 .022
Overall Row Spacing eB - - .430
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
3.
1.
protrusions shall not exceed .010" per side.
2.
4.
Notes:
§
--
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
Pin 1 visual index feature may vary, but must be located within the hatched area.
§ Significant Characteristic
Dimensioning and tolerancing per ASME Y14.5M
e
DATUM A DATUM A
e
b
e
2
b
e
2
ALTERNATE LEAD DESIGN
(VENDOR DEPENDENT)