Datasheet
Table Of Contents
- 12A High-Speed MOSFET Drivers
- Features
- Applications
- General Description
- Package Types
- Functional Block Diagram
- 1.0 Electrical Characteristics
- 2.0 Typical Performance Curves
- FIGURE 2-1: Rise Time vs. Supply Voltage
- FIGURE 2-2: Rise Time vs. Capacitive Load
- FIGURE 2-3: Fall Time vs. Supply Voltage
- FIGURE 2-4: Fall Time vs. Capacitive Load
- FIGURE 2-5: Rise and Fall Times vs. Temperature
- FIGURE 2-6: Crossover Energy vs. Supply Voltage
- FIGURE 2-7: Propagation Delay vs. Supply Voltage
- FIGURE 2-8: Propagation Delay vs. Input Amplitude
- FIGURE 2-9: Propagation Delay vs. Temperature
- FIGURE 2-10: Quiescent Supply Current vs. Supply Voltage
- FIGURE 2-11: Quiescent Supply Current vs. Temperature
- FIGURE 2-12: Input Threshold vs. Temperature
- FIGURE 2-13: Input Threshold vs. Supply Voltage
- FIGURE 2-14: High State Output Resistance vs. Supply Voltage
- FIGURE 2-15: Low State Output Resistance vs. Supply Voltage
- FIGURE 2-16: Supply Current vs. Capacitive Load (VDD = 18V)
- FIGURE 2-17: Supply Current vs. Capacitive Load (VDD = 12V)
- FIGURE 2-18: Supply Current vs. Capacitive Load (VDD = 6V)
- FIGURE 2-19: Supply Current vs. Frequency (VDD = 18V)
- FIGURE 2-20: Supply Current vs. Frequency (VDD = 12V)
- FIGURE 2-21: Supply Current vs. Frequency (VDD = 6V)
- 3.0 Pin Descriptions
- 4.0 Applications Information
- 5.0 Packaging Information
- Appendix A: Revision History
- Product Identification System
- Trademarks
- Worldwide Sales and Service
TC4451/TC4452
DS20001987C-page 16 2006-2014 Microchip Technology Inc.
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For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
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Microchip Technology Drawing No. C04-018D Sheet 1 of 2
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