Datasheet

SST25VF016B
DS20005044C-page 24  2015 Microchip Technology Inc.
6.0 PACKAGING DIAGRAMS
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Microchip Technology Drawing C04-14005A Sheet 1 of 1
8-Lead Small Outline Integrated Circuit (S2AE/F) - .208 Inch Body [SOIC]
Note:
1. All linear dimensions are in millimeters (max/min).
2. Coplanarity: 0.1 mm
3. Maximum allowable mold flash is 0.15 mm at the package ends and 0.25 mm between leads.