Datasheet

 2016-2019 Microchip Technology Inc. DS50002489D-page 23
RN4870/71
FIGURE 4-13: RECOMMENDATIONS FOR THE PLACEMENT OF THE MODULE ON THE HOST
PCB BOARD
4.5 Soldering Recommendations
The RN4870/71 Bluetooth module is assembled using
standard lead-free reflow profile IPC/JEDEC

J-STD-020.
The module can be soldered to the host PCB using
standard leaded and lead-free solder reflow profiles.
To avoid damaging the module, the following recom-
mendations are given:
• Microchip Technology Application Note, “AN233
Solder Reflow Recommendation” (DS00233)
provides solder reflow recommendations
•Do not exceed peak temperature (T
P
) of 250°C
• Refer to the solder paste data sheet for specific
reflow profile recommendations
• Use no-clean flux solder paste
•Do not wash as moisture can be trapped under
the shield
• Use only one flow. If the PCB requires multiple
flows, apply the module on the final flow.
Acceptable
Best
Acceptable
Lowest

performance