Datasheet
Table Of Contents
- Features
- RF/Analog
- Data Throughput
- Operating Conditions
- MAC/Baseband/Higher Layer Features
- Applications
- Description
- Table of Contents
- Most Current Data Sheet
- Errata
- Customer Notification System
- 1.0 Device Overview
- 2.0 Application Information
- 3.0 Electrical Characteristics
- 4.0 Radio Characteristics
- 5.0 Physical Dimensions
- 6.0 Reflow profile
- 7.0 Module Placement
- 8.0 Ordering Information
- 9.0 Regulatory Approval
- Appendix A: Revision History
- The Microchip WebSite
- Customer Change Notification Service
- Customer Support
- Product Identification System
- AMERICAS
- ASIA/PACIFIC
- ASIA/PACIFIC
- EUROPE
- Austria - Wels
- Denmark - Copenhagen
- Finland - Espoo
- France - Paris
- Germany - Garching
- Germany - Haan
- Germany - Heilbronn
- Germany - Karlsruhe
- Germany - Munich
- Germany - Rosenheim
- Israel - Ra’anana
- Italy - Milan
- Italy - Padova
- Netherlands - Drunen
- Norway - Trondheim
- Poland - Warsaw
- Romania - Bucharest
- Spain - Madrid
- Sweden - Gothenberg
- Sweden - Stockholm
- UK - Wokingham
- Worldwide Sales and Service
- Trademarks
- Worldwide Sales and Service

2016-2019 Microchip Technology Inc. DS50002519D-page 39
RN4678
APPENDIX A: REVISION HISTORY
Revision A (June 2016)
This is the initial released version of the document.
Revision B (January 2018)
• Updated Figure 1-1, Figure 1-2, and Figure 5-3.
• Updated Ta bl e 1-1.
• Added Section 2.2 “Flow Control”.
• Updated Section 8.0 “Ordering Information”
• Updated Section “Product Identification Sys-
tem”
• Removed Figure 1-3, Figure 2-9, Figure 5-4,
Figure 5-5, and Figure 5-6.
Revision C (March 2019)
This revision includes the following changes and minor
updates to text and formatting, which were incorpo
-
rated throughout the document.
Revision D (May 2019)
Updated China labeling ID in 9.7.1 “LABELING AND
USER INFORMATION REQUIREMENTS”.
TABLE 9-1: MAJOR SECTION UPDATES
Section Description
Section “Features” Updated certification information
Section “Data Throughput” Updated Kbytes/s
Section 1.0 “Device Overview” Updated Figure 1-1 and Tabl e 1-1
Chapter 2.0, Application Information • Updated Table 2-3
• Added SW_BTN note in Section 2.5 “Software Button
(SW_BTN)”
Chapter 3.0, Electrical Characteristics • Updated Storage temperature
• Updated current consumption values in Tabl e 3-6 and Tabl e 3-7
Chapter 5.0, Physical Dimensions Updated Figure 5-1 and Figure 5-2
Chapter 8.0, Ordering Information Updated Table 8-1 with certification information
Chapter 9.0, Regulatory Approval • Updated IC to ISED in Section 9.2 “Canada”
• Updated RED certification information in Section 9.3 “Europe”
• Updated Section 9.6 “Taiwan”
• Added Section 9.7 “China”