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Table Of Contents
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- Data Throughput
- Operating Conditions
- MAC/Baseband/Higher Layer Features
- Applications
- Description
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- Errata
- Customer Notification System
- 1.0 Device Overview
- 2.0 Application Information
- 3.0 Electrical Characteristics
- 4.0 Radio Characteristics
- 5.0 Physical Dimensions
- 6.0 Reflow profile
- 7.0 Module Placement
- 8.0 Ordering Information
- 9.0 Regulatory Approval
- Appendix A: Revision History
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2016-2019 Microchip Technology Inc. DS50002519D-Page 27
RN4678
7.0 MODULE PLACEMENT
For a Bluetooth wireless product, the antenna place-
ment affects the performance of the whole system. The
antenna requires free space to radiate the RF signal
and it cannot be surrounded by the ground plane.
Microchip recommends that the areas underneath the
antenna on the host PCB must not contain copper on
top, inner or bottom layer.
Figure 7-1 illustrates an
example of good and poor antenna placement on a
host PCB with ground plane.
The ground plane can be extended beyond the mini-
mum recommended as required for the main PCB EMC
noise reduction. For the best range performance, keep
all external metal away from the ceramic chip antenna,
that is minimum 15 mm away.
FIGURE 7-1: MODULE PLACEMENT EXAMPLES
TABLE 7-1: RECOMMENDED ANTENNA
Description Manufacturer Part Number Manufacturer
ANT ANT3216A063R2400A PIFA 2.4 GHz L3.2W1.6 ANT3216A063R2400A YAGEO