Datasheet

 2016-2019 Microchip Technology Inc. DS50002519D-Page 25
RN4678
6.0 REFLOW PROFILE
The RN4678 is highly recommended to be assembled
using a standard lead-free reflow profile, IPC/JEDEC
J-STD-020. The RN4678 can be soldered to the host
PCB by using the standard leaded and lead-free solder
reflow profile.
To avoid damage to the module, follow these recom-
mendations:
• Follow solder reflow recommendations provided
in Microchip Technology Application Note AN233
Solder Reflow Recommendation (DS00233).
• Refer to the solder paste data sheet for specific
reflow profile recommendations.
•Do not exceed the peak temperature (T
P
) of
250ºC.
• Use no-clean flux solder paste.
•Do not wash as moisture can be trapped under
the shield.
• Use only one flow. If the PCB requires multiple
flows, apply the module on the final flow.
• Standard: IPC/JEDEC J-STD-020
- Condition: Preheat:150~200 ℃ for 60~120
seconds.
- Average ramp-up rate (217 ℃ to peak): 
3 ℃ /sec max.
- Temperature maintained above 217 ℃:
60~150 seconds.
- Time within 5 ℃ of peak temperature: 
30 ~ 40 seconds.
- Peak temperature: 260 +5/-0 ℃ .
- Ramp-down rate (peak to 217): 6 ℃ /sec.
max.
- Time 25 ℃ to peak temperature: 8 minutes
max.
- Cycle interval: 5 minutes
FIGURE 6-1: REFLOW PROFILE