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- Description
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- 1.0 Device Overview
- 2.0 Application Information
- 3.0 Electrical Characteristics
- 4.0 Radio Characteristics
- 5.0 Physical Dimensions
- 6.0 Reflow profile
- 7.0 Module Placement
- 8.0 Ordering Information
- 9.0 Regulatory Approval
- Appendix A: Revision History
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2016-2018 Microchip Technology Inc. DS50002519D-Page 23
RN4678
Figure 5-3 illustrates the recommendations for
mounting the RN4678 on the host PCB, and also
shows the minimum ground plane area to the left and
right of the module for the best antenna performance.
Avoid top copper layer near the test pin area. When
designing the host PCB, the areas under the antenna
must not contain any top, inner or bottom copper layer.
A low-impedance ground plane ensures best radio per
-
formance (best range and lowest noise). The ground
plane can be extended beyond the minimum recom
-
mended as required for the host PCB EMC noise
reduction. For best range performance, keep all exter
-
nal metal at least 31 mm away from the ceramic chip
antenna.
FIGURE 5-3: RN4678 HOST PCB MOUNTING SUGGESTION
This area needs to
have top metal copper
that is connected to
Ground for optimal
functioning of the chip
antenna.
This purple hashed
area must not have
any top metal layer
copper. It can have
bottom copper layer.
This area (purple with
dots) needs to have
both top and bottom
copper layers
connected to Ground
for optimal operation
of the antenna.