Datasheet

RN42/RN42N
DS50002328A-page 10 2015 Microchip Technology Inc.
2.7 Soldering Recommendations
The RN42/RN42N wireless module was assembled
using standard lead-free reflow profile IPC/JEDEC J-
STD-020.
The module can be soldered to the host PCB using
standard leaded and lead-free solder reflow profiles.
To avoid damaging the module, the following recom-
mendations are given:
Microchip Technology Application Note,” AN233
Solder Reflow Recommendation” (DS00233) pro-
vides solder reflow recommendations
Do not exceed peak temperature (T
p
) of 250 C°
Refer to the Solder Paste data sheet for specific
reflow profile recommendations
Use no-clean flux solder paste
Do not wash as moisture can be trapped under
the shield
Use only one flow. If the PCB requires multiple
flows, apply the module on the final flow.
2.8 SPI Interface
The SPI Interface is primarily used for factory program-
ming, test, and diagnostics. Although not required, the
SPI interface is useful for restoring a corrupted flash
image or enabling test modes required for certification
testing.
When module is installed in a final product that requires
European type approval, see Section 3.3 “Europe”, it
is recommended that the SPI interface should be
accessible via 6-pin header as shown in Figure 2-6.
FIGURE 2-6: OPTIONAL SPI
INTERFACE
2.9 Bluetooth SIG QDID
The RN42 has a QDID registered with the Bluetooth
SIG. The manufacturer using the RN42 module in their
end product can reference this QDID when filing an
EPL (end product listing) to use Bluetooth
®
brand and
logo. For more information, please visit the Bluetooth
SIG at www.bluetooth.org.
QDID: B014867