Datasheet

RN4020

DS50002279B-page 14  2015 Microchip Technology Inc.

FIGURE 7-2: ANTENNA PLOT

FIGURE 7-3: 3D RADIATION PATTERN

AND ANTENNA

ORIENTATION

7.3 Soldering Recommendations

The RN4020 wireless module is assembled using

standard lead-free reflow profile IPC/JEDEC

J-STD-020.

The module can be soldered to the host PCB using

standard leaded and lead-free solder reflow profiles.

To avoid damaging the module, the following recom-

mendations are given:

• Microchip Technology Application Note, AN233

Solder Reflow Recommendation (DS00233) pro-

vides solder reflow recommendations

• Do not exceed peak temperature (T

) of 250°C

• Refer to the solder paste data sheet for specific

reflow profile recommendations

• Use no-clean flux solder paste

• Do not wash as moisture can be trapped under

the shield

• Use only one flow. If the PCB requires multiple

flows, apply the module on the final flow.