Datasheet

 2014 Microchip Technology Inc. DS70005171A-page 7
RN171
FIGURE 1-5: RN171 MODULE
PHYSICAL DIMENSIONS
(BOTTOM VIEW)
FIGURE 1-6: RECOMMENDED HOST
PCB FOOTPRINT
FIGURE 1-7: SOLDER REFLOW TEMPERATURE PROFILE
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3DG'HWDLO
Note: Pads at:
0.190 x 0.890
0.260 x 0.025
0.575 x 1.035
are grounded plated through holes for shield mounting
Bottom
View
Dimensions are in inches.
Tolerances:
PCB Outline: +/- 0.005”
PCB Thickness: +/- 0.001”
0.060"
0.080"
0.040"
0.000 0.400 0.550 0.700
0.050
0.100
0.150
0.200
0.250
0.300
0.350
0.400
0.450
0.500
0.550
0.600
0.650
0.700
0.750
0.800
0.850
0.200 0.250 0.300 0.350 0.400 0.450 0.500
1
0.260
0.025
0.000
0.190
1.050
0.900
0.950
1.000
0.890
0.575
1.035
Note:
0.190 x 0.890
0.575 x 1.035
0.260 x 0.025
are grounded plated through
holes for shield mounting .
Pads at
Recommend keeping host PCB
top layer signal traces away
(0.050" diameter ).