User Manual

 2014 Microchip Technology Inc. DS50002325A-page 13
RN41/42 EVALUATION KIT
USER’S GUIDE
Chapter 1. Overview
1.1 INTRODUCTION
This user’s guide describes the hardware and software setup for RN41 and RN42 Eval-
uation Kits. The RN41 and RN42 evaluation boards are field-ready with Bluetooth
®
SIG
qualified platforms based on RN41 and RN42 modules, respectively. The boards have
the flexibility to connect directly to computer/laptops via a standard USB interface (via
the FTDI chipset), or to embedded controllers through the TTL UART interface. The
status LEDs, DIP switches and Signal headers/connectors enable integration into
existing systems. The user can configure and control the modules from a console
using simple ASCII command language. Once the configuration is setup, the module
can connect over Bluetooth.
The evaluation kit configures the Bluetooth module using the command interface, cre-
ate connections, and transfer data. The RN-41-EK and RN-42-EK evaluation boards
support the Serial Port Profile (SPP) and Human Interface Device (HID) profiles. In this
user’s guide, the SPP profile is used for the instructions. For more information on the
profiles and how to switch between these profiles, refer to the Bluetooth Data Module
Command Reference and Advanced Information User's Guide.
For data sheet and other details related to RN41 and RN42 modules, refer to the Micro-
chip web site at http://www.microchip.com.
This chapter discusses the following topics:
• RN41/42 Evaluation Kit Features
• RN41/42 Evaluation Kit Contents and Part Details
• RN41/42 Evaluation Kits/Board Contents
• RN41/42 Evaluation Kit Related Information Contents
1.2 RN41/42 EVALUATION KIT FEATURES
1.2.1 RN41 Evaluation Board Features
The RN41 Evaluation Board has the following features:
• Supports fully qualified Bluetooth version 2.1 module, supports version 2.1 +
Enhanced Data Rate (EDR)
• UART (SPP or HCI) and USB (only HCI) data connection interfaces
• Sustained SPP data rates: 240 Kbps (slave), 300 Kbps (master)
• HCI data rates: 1.5 Mbps sustained, 3.0 Mbps burst in HCI mode
• Embedded Bluetooth stack profiles included (requires no host stack): GAP, SDP,
RFCOMM, and L2CAP protocols, with SPP and DUN profile support
• Supports Class 1 high-power amplifier with on-board ceramic RF chip antenna
(RN41) or without antenna (RN41N)
• Supports 2 LEDs, 4 DIP switches for Configuration, SPI pads for firmware pro-
grammings
• Postage-stamp sized form factor of 44 mm x 24 mm x 13 mm.