Datasheet

 2015 Microchip Technology Inc. Preliminary DS60001320B-page 679
PIC32MZ Embedded Connectivity with Floating Point Unit (EF) Family
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
RECOMMENDED LAND PATTERN
SILK SCREEN
Dimension Limits
Units
C1
Optional Center Pad Length
Contact Pad Spacing
Contact Pad Spacing
Optional Center Pad Chamfer (X4)
C2
W3
W2
0.10
6.60
MILLIMETERS
MIN
MAX
8.50
8.50
Contact Pad Length (X124)
Contact Pad Width (X124)
X2
X1
0.30
0.30
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
Microchip Technology Drawing No. C04-2193A
NOM
Optional Center Pad Width T2
Contact to Center Pad Clearance (X4) G5
Pad Clearance G4
Pad Clearance G3
Pad Clearance G2
Contact Pitch 0.50 BSCE
Pad Clearance G1
6.60
0.30
0.20
0.20
0.20
0.20
E
E/2
W2
W3
G2
G4
X1
G5
X4
C2
C1
G3
G1
X2
E
T2
124-Very Thin Leadless Array Package (TL) – 9x9x0.9 mm Body [VTLA]