Datasheet

PIC32MZ Embedded Connectivity with Floating Point Unit (EF) Family
DS60001320B-page 658 Preliminary  2015 Microchip Technology Inc.
TABLE 37-46: ETHERNET MODULE SPECIFICATIONS
FIGURE 37-24: MDIO SOURCED BY THE PIC32 DEVICE
FIGURE 37-25: MDIO SOURCED BY THE PHY
AC CHARACTERISTICS
Standard Operating Conditions: 2.1V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial 
-40°C  TA  +125°C for Extended
Param.
No.
Characteristic Min. Typical Max. Units Conditions
MIIM Timing Requirements
ET1 MDC Duty Cycle 40 — 60 % —
ET2 MDC Period 400 — — ns —
ET3 MDIO Output Setup and Hold 10 — 10 ns See Figure 37-24
ET4 MDIO Input Setup and Hold 0 — 300 ns See Figure 37-25
MII Timing Requirements
ET5 TX Clock Frequency — 25 — MHz —
ET6 TX Clock Duty Cycle 35 — 65 % —
ET7 ETXDx, ETEN, ETXERR Output Delay 0 — 25 ns See Figure 37-26
ET8 RX Clock Frequency — 25 — MHz —
ET9 RX Clock Duty Cycle 35 — 65 % —
ET10 ERXDx, ERXDV, ERXERR Setup and Hold 10 — 30 ns See Figure 37-27
RMII Timing Requirements
ET11 Reference Clock Frequency — 50 — MHz —
ET12 Reference Clock Duty Cycle 35 — 65 % —
ET13 ETXDx, ETEN, Setup and Hold 2 — 4 ns —
ET14 ERXDx, ERXDV, ERXERR Setup and Hold 2 — 4 ns —
ET3 (Hold)
(Setup) ET3
MDC
MDIO
V
IHMIN
VILMAX
VIHMIN
VILMAX
VIHMIN
VILMAX
VIHMIN
VILMAX
ET4
MDC
MDIO