Datasheet

 2015 Microchip Technology Inc. Preliminary DS60001320B-page 613
PIC32MZ Embedded Connectivity with Floating Point Unit (EF) Family
TABLE 37-4: DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
DC CHARACTERISTICS
Standard Operating Conditions: 2.1V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  T
A  +85°C for Industrial 
-40°C  T
A  +125°C for Extended
Param.
No.
Symbol Characteristics Min. Typical Max. Units Conditions
Operating Voltage
DC10 VDD Supply Voltage (Note 1) 2.1—3.6V —
DC12 VDR RAM Data Retention Voltage
(Note 2)
2.0 — — V —
DC16 V
POR VDD Start Voltage
to Ensure Internal 
Power-on Reset Signal (Note 3)
1.75 — — V —
DC17 SVDD VDD Rise Rate
to Ensure Internal
Power-on Reset Signal
0.000011 — 1.1 V/µs 300 ms to 3 µs @ 3.3V
Note 1: Overall functional device operation at VBORMIN < VDD < VDDMIN is guaranteed, but not characterized. All
device Analog modules, such as ADC, etc., will function, but with degraded performance below V
DDMIN.
Refer to parameter BO10 in Table 37-5 for BOR values.
2: This is the limit to which V
DD can be lowered without losing RAM data.
3: This is the limit to which VDD must be lowered to ensure Power-on Reset.
TABLE 37-5: ELECTRICAL CHARACTERISTICS: BOR
DC CHARACTERISTICS
Standard Operating Conditions: 2.1V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial 
-40°C  TA  +125°C for Extended
Param.
No.
Symbol Characteristics Min.
(1)
Typical Max. Units Conditions
BO10
VBOR BOR Event on VDD transition
high-to-low (Note 2)
1.88 — 2.02 V —
Note 1: Parameters are for design guidance only and are not tested in manufacturing.
2: Overall functional device operation at VBORMIN < VDD < VDDMIN is tested, but not characterized. All device
Analog modules, such as ADC, etc., will function, but with degraded performance below V
DDMIN.