Datasheet

2015 Microchip Technology Inc. Preliminary DS60001320B-page 1
PIC32MZ Embedded Connectivity
with Floating Point Unit (EF) Family
Operating Conditions
2.1V to 3.6V, -40ºC to +85ºC, DC to 200 MHz
2.1V to 3.6V, -40ºC to +125ºC (Planned)
Core: 200 MHz (up to 330 DMIPS) M-Class
16 KB I-Cache, 4 KB D-Cache
FPU for fast single- and double-precision math
MMU for optimum embedded OS execution
microMIPS™ mode for up to 35% smaller code size
DSP-enhanced core:
- Four 64-bit accumulators
- Single-cycle MAC, saturating, and fractional math
- IEEE 754-compliant
Code-efficient (C and Assembly) architecture
Clock Management
Programmable PLLs and oscillator clock sources
Fail-Safe Clock Monitor (FSCM)
Independent Watchdog Timers (WDT) and Deadman
Timer (DMT)
Fast wake-up and start-up
Power Management
Low-power modes (Sleep and Idle)
Integrated Power-on Reset (POR) and Brown-out Reset
(BOR)
Memory Interfaces
50 MHz External Bus Interface (EBI)
50 MHz Serial Quad Interface (SQI)
Audio and Graphics Interfaces
Graphics interfaces: EBI or PMP
Audio data communication: I
2
S, LJ, and RJ
Audio control interfaces: SPI and I
2
C™
Audio master clock: Fractional clock frequencies with USB
synchronization
High-Speed (HS) Communication Interfaces
(with Dedicated DMA)
USB 2.0-compliant Hi-Speed On-The-Go (OTG) controller
10/100 Mbps Ethernet MAC with MII and RMII interface
Security Features
Crypto Engine with RNG for data encryption/decryption and
authentication (AES, 3DES, SHA, MD5, and HMAC)
Advanced memory protection:
- Peripheral and memory region access control
Direct Memory Access (DMA)
Eight channels with automatic data size detection
Programmable Cyclic Redundancy Check (CRC)
Advanced Analog Features
12-bit ADC module:
- 18 Msps with up to six Sample and Hold (S&H) circuits
(five dedicated and one shared)
- Up to 48 analog inputs
- Can operate during Sleep and Idle modes
- Multiple trigger sources
- Six Digital Comparators and six Digital Filters
Two comparators with 32 programmable voltage
references
Temperature sensor with ±2ºC accuracy
Communication Interfaces
Two CAN modules (with dedicated DMA channels):
- 2.0B Active with DeviceNet™ addressing support
Six UART modules (25 Mbps):
- Supports up to LIN 2.1 and IrDA
®
protocols
Six 4-wire SPI modules (up to 50 MHz)
SQI configurable as an additional SPI module (50 MHz)
•Five I
2
C modules (up to 1 Mbaud) with SMBus support
Parallel Master Port (PMP)
Peripheral Pin Select (PPS) to enable function remap
Timers/Output Compare/Input Capture
Nine 16-bit or up to four 32-bit timers/counters
Nine Output Compare (OC) modules
Nine Input Capture (IC) modules
Real-Time Clock and Calendar (RTCC) module
Input/Output
5V-tolerant pins with up to 32 mA source/sink
Selectable open drain, pull-ups, pull-downs, and slew rate
controls
External interrupts on all I/O pins
PPS to enable function remap
Qualification and Class B Support
AEC-Q100 REVG (Grade 1 -40ºC to +125ºC) Planned
Class B Safety Library, IEC 60730
Back-up internal oscillator
Debugger Development Support
In-circuit and in-application programming
4-wire MIPS
®
Enhanced JTAG interface
Unlimited software and 12 complex breakpoints
IEEE 1149.2-compatible (JTAG) boundary scan
Non-intrusive hardware-based instruction trace
Software and Tools Support
C/C++ compiler with native DSP/fractional and FPU support
•MPLAB
®
Harmony Integrated Software Framework
TCP/IP, USB, Graphics, and mTouch™ middleware
MFi, Android™, and Bluetooth
®
audio frameworks
RTOS Kernels: Express Logic ThreadX, FreeRTOS™,
OPENRTOS
®
, Micriµm
®
µC/OS™, and SEGGER embOS
®
Packages
Type QFN TQFP VTLA LQFP
Pin Count 64 64 100 144 124 144
I/O Pins (up to) 53 53 78 120 98 120
Contact/Lead Pitch 0.50 mm 0.50 mm 0.40 mm 0.50 mm 0.40 mm 0.50 mm 0.50 mm
Dimensions 9x9x0.9 mm 10x10x1 mm 12x12x1 mm 14x14x1 mm 16x16x1 mm 9x9x0.9 mm 20x20x1.40 mm
32-bit MCUs (up to 2 MB Live-Update Flash and 512 KB SRAM) with FPU,
Audio and Graphics Interfaces, HS USB, Ethernet, and Advanced Analog

Summary of content (718 pages)