Datasheet

 2011-2017 Microchip Technology Inc. DS30009995E-page 265
PIC24FV32KA304 FAMILY
TABLE 29-1: THERMAL OPERATING CONDITIONS
Rating Symbol Min Typ Max Unit
Operating Junction Temperature Range T J -40 — +140 °C
Operating Ambient Temperature Range T
A -40 — +125 °C
Power Dissipation:
Internal Chip Power Dissipation:
P
INT = V DD x (I DD –  I OH )
P D P INT + P I / O W
I/O Pin Power Dissipation:
P
I / O =  ({V DD – V OH } x I OH ) +  (V OL x I OL )
Maximum Allowed Power Dissipation P
DMAX (T J – T A )/ JA W
TABLE 29-2: THERMAL PACKAGING CHARACTERISTICS
Characteristic Symbol Typ Max Unit Notes
Package Thermal Resistance, 20-Pin SPDIP  JA 62.4 — °C/W 1
Package Thermal Resistance, 28-Pin SPDIP  JA 60 — °C/W 1
Package Thermal Resistance, 20-Pin SSOP  JA 108 — °C/W 1
Package Thermal Resistance, 28-Pin SSOP  JA 71 — °C/W 1
Package Thermal Resistance, 20-Pin SOIC  JA 75 — °C/W 1
Package Thermal Resistance, 28-Pin SOIC  JA 80.2 — °C/W 1
Package Thermal Resistance, 28-Pin QFN  JA 32 — °C/W 1
Package Thermal Resistance, 44-Pin QFN  JA 29 — °C/W 1
Package Thermal Resistance, 48-Pin UQFN  JA ——°C/W 1
Note 1: Junction to ambient thermal resistance, Theta- JA ( JA ) numbers are achieved by package simulations.
TABLE 29-3: DC CHARACTERISTICS: TEMPERATURE AND VOLTAGE SPECIFICATIONS
DC CHARACTERISTICS
Standard Operating Conditions: 1.8V to 3.6V PIC24F32KA3XX
2.0V to 5.5V PIC24FV32KA3XX
Operating temperature -40°C  T A  +85°C for Industrial
-40°C  T
A  +125°C for Extended
Param
No.
Symbol Characteristic Min Typ
(1)
Max Units Conditions
DC10 V DD Supply Voltage 1.8 — 3.6 V For F devices
2.0 — 5.5 V For FV devices
DC12 V
DR RAM Data Retention
Voltage
(2)
1.5 — — V For F devices
1.7 — — V For FV devices
DC16 V
POR V DD Start Voltage
to Ensure Internal
Power-on Reset Signal
V
SS —50mVV DD must be maintained in this range
for at least 64ms.
DC17 SV DD V DD Rise Rate
to Ensure Internal
Power-on Reset Signal
0.05 — — V/ms 0-3.3V in 0.1s
0-2.5V in 60 ms
Note 1: Data in “Typ” column is at 3.3V, +25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
2: This is the limit to which V DD can be lowered without losing RAM data.