Datasheet
Table Of Contents
- Power Management Modes
- High-Performance CPU
- Peripheral Features
- Analog Features
- Special Microcontroller Features
- Pin Diagrams
- Pin Diagrams
- Pin Diagrams
- Pin Diagrams
- Pin Diagrams
- Table of Contents
- Most Current Data Sheet
- Errata
- Customer Notification System
- 1.0 Device Overview
- 2.0 Guidelines for Getting Started with 16-Bit Microcontrollers
- 3.0 CPU
- 4.0 Memory Organization
- 4.1 Program Address Space
- 4.2 Data Address Space
- 4.2.1 Data Space Width
- 4.2.2 Data Memory Organization and Alignment
- 4.2.3 Near Data Space
- 4.2.4 SFR Space
- TABLE 4-2: Implemented Regions of SFR Data Space
- TABLE 4-3: CPU Core Registers Map
- TABLE 4-4: ICN Register Map
- TABLE 4-5: Interrupt Controller Register Map
- TABLE 4-6: Timer Register Map
- TABLE 4-7: Input Capture Register Map
- TABLE 4-8: Output Compare Register Map
- TABLE 4-9: I2Cx Register Map
- TABLE 4-10: UARTx Register Map
- TABLE 4-11: SPIx Register Map
- TABLE 4-12: PORTA Register Map
- TABLE 4-13: PORTB Register Map
- TABLE 4-14: PORTC Register Map(1)
- TABLE 4-15: Pad Configuration Register Map
- TABLE 4-16: A/D Register Map
- TABLE 4-17: CTMU Register Map
- TABLE 4-18: Analog Select Register Map
- TABLE 4-19: Real-Time Clock and Calendar Register Map
- TABLE 4-20: Triple Comparator Register Map
- TABLE 4-21: CRC Register Map
- TABLE 4-22: Clock Control Register Map
- TABLE 4-23: Deep Sleep Register Map
- TABLE 4-24: NVM Register Map
- TABLE 4-25: Ultra Low-Power Wake-up Register Map
- TABLE 4-26: PMD Register Map
- 4.2.5 Software Stack
- 4.3 Interfacing Program and Data Memory Spaces
- 5.0 Flash Program Memory
- 5.1 Table Instructions and Flash Programming
- 5.2 RTSP Operation
- 5.3 Enhanced In-Circuit Serial Programming
- 5.4 Control Registers
- 5.5 Programming Operations
- Register 5-1: NVMCON: Flash Memory Control Register
- 5.5.1 Programming Algorithm for Flash Program Memory
- EXAMPLE 5-1: Erasing a Program Memory Row – Assembly Language Code
- EXAMPLE 5-2: Erasing a Program Memory Row – ‘C’ Language Code
- EXAMPLE 5-3: Loading the Write Buffers – Assembly Language Code
- EXAMPLE 5-4: Loading the Write Buffers – ‘C’ Language Code
- EXAMPLE 5-5: Initiating a Programming Sequence – Assembly Language Code
- EXAMPLE 5-6: Initiating a Programming Sequence – ‘C’ Language Code
- 6.0 Data EEPROM Memory
- 7.0 Resets
- 8.0 Interrupt Controller
- 8.1 Interrupt Vector Table (IVT)
- 8.2 Reset Sequence
- 8.3 Interrupt Control and Status Registers
- Register 8-1: SR: ALU STATUS Register
- Register 8-2: CORCON: CPU Control Register
- Register 8-3: INTCON1: Interrupt Control Register 1
- Register 8-4: INTCON2: Interrupt Control Register2
- Register 8-5: IFS0: Interrupt Flag Status Register 0
- Register 8-6: IFS1: Interrupt Flag Status Register 1
- Register 8-7: IFS2: Interrupt Flag Status Register 2
- Register 8-8: IFS3: Interrupt Flag Status Register 3
- Register 8-9: IFS4: Interrupt Flag Status Register 4
- Register 8-10: IFS5: Interrupt Flag Status Register 5
- Register 8-11: IEC0: Interrupt Enable Control Register 0
- Register 8-12: IEC1: Interrupt Enable Control Register 1
- Register 8-13: IEC2: Interrupt Enable Control Register 2
- Register 8-14: IEC3: Interrupt Enable Control Register 3
- Register 8-15: IEC4: Interrupt Enable Control Register 4
- Register 8-16: IEC5: Interrupt Enable Control Register 5
- Register 8-17: IPC0: Interrupt Priority Control Register 0
- Register 8-18: IPC1: Interrupt Priority Control Register 1
- Register 8-19: IPC2: Interrupt Priority Control Register 2
- Register 8-20: IPC3: Interrupt Priority Control Register 3
- Register 8-21: IPC4: Interrupt Priority Control Register 4
- Register 8-22: IPC5: Interrupt Priority Control Register 5
- Register 8-23: IPC6: Interrupt Priority Control Register 6
- Register 8-24: IPC7: Interrupt Priority Control Register 7
- Register 8-25: IPC8: Interrupt Priority Control Register 8
- Register 8-26: IPC9: Interrupt Priority Control Register 9
- Register 8-27: IPC12: Interrupt Priority Control Register 12
- Register 8-28: IPC15: Interrupt Priority Control Register 15
- Register 8-29: IPC16: Interrupt Priority Control Register 16
- Register 8-30: IPC18: Interrupt Priority Control Register 18
- Register 8-31: IPC19: Interrupt Priority Control Register 19
- Register 8-32: IPC20: Interrupt Priority Control Register 20
- Register 8-33: INTTREG: Interrupt Control and Status Register
- 8.4 Interrupt Setup Procedures
- 9.0 Oscillator Configuration
- 10.0 Power-Saving Features
- 11.0 I/O Ports
- 12.0 Timer1
- 13.0 Timer2/3 and Timer4/5
- FIGURE 13-1: Timer2/3 and Timer4/5 (32-Bit) Block Diagram
- FIGURE 13-2: Timer2 and Timer4 (16-Bit Synchronous) Block Diagram
- FIGURE 13-3: Timer3 and Timer5 (16-Bit Asynchronous) Block Diagram
- Register 13-1: TxCON: Timer2 and Timer4 Control Register
- Register 13-2: TyCON: Timer3 and Timer5 Control Register
- 14.0 Input Capture with Dedicated Timers
- 15.0 Output Compare with Dedicated Timers
- 16.0 Serial Peripheral Interface (SPI)
- FIGURE 16-1: SPI1 Module Block Diagram (Standard Buffer Mode)
- FIGURE 16-2: SPI1 Module Block Diagram (Enhanced Buffer Mode)
- Register 16-1: SPIxSTAT: SPIx Status and Control Register
- Register 16-2: SPIxCON1: SPIx Control Register 1
- Register 16-3: SPIxCON2: SPIx Control Register 2
- EQUATION 16-1: Relationship Between Device and SPIx Clock Speed(1)
- TABLE 16-1: Sample SCKx Frequencies(1,2)
- 17.0 Inter-Integrated Circuit (I2C)
- 18.0 Universal Asynchronous Receiver Transmitter (UART)
- 19.0 Real-Time Clock and Calendar (RTCC)
- 20.0 32-Bit Programmable Cyclic Redundancy Check (CRC) Generator
- 21.0 High/Low-Voltage Detect (HLVD)
- 22.0 12-Bit A/D Converter with Threshold Detect
- FIGURE 22-1: 12-Bit A/D Converter Block Diagram
- 22.1 A/D Control Registers
- 22.1.1 Control Registers
- 22.1.2 A/D Result Buffers
- Register 22-1: AD1CON1: A/D Control Register 1
- Register 22-2: AD1CON2: A/D Control Register 2
- Register 22-3: AD1CON3: A/D Control Register 3
- Register 22-4: AD1CON5: A/D Control Register 5
- Register 22-5: AD1CHS: A/D Sample Select Register
- Register 22-6: AD1CHITH: A/D Scan Compare Hit Register (High Word)(1)
- Register 22-7: AD1CHITL: A/D Scan Compare Hit Register (Low Word)(1)
- Register 22-8: AD1CSSH: A/D Input Scan Select Register (High Word)(1)
- Register 22-9: AD1CSSL: A/D Input Scan Select Register (Low Word)(1)
- Register 22-10: AD1CTMUENH: A/D CTMU Enable Register (High Word)(1)
- Register 22-11: AD1CTMUENL: A/D CTMU Enable Register (Low Word)(1)
- 22.2 A/D Sampling Requirements
- 22.3 Transfer Function
- 22.4 Buffer Data Formats
- FIGURE 22-4: A/D Output Data Formats (12-Bit)
- TABLE 22-1: Numerical Equivalents of Various Result Codes: 12-Bit Integer Formats
- TABLE 22-2: Numerical Equivalents of Various Result Codes: 12-Bit Fractional Formats
- FIGURE 22-5: A/D Output Data Formats (10-Bit)
- TABLE 22-3: Numerical Equivalents of Various Result Codes: 10-Bit Integer Formats
- TABLE 22-4: Numerical Equivalents of Various Result Codes: 10-Bit Fractional Formats
- 23.0 Comparator Module
- 24.0 Comparator Voltage Reference
- 25.0 Charge Time Measurement Unit (CTMU)
- 26.0 Special Features
- 26.1 Configuration Bits
- TABLE 26-1: Configuration Registers Locations
- Register 26-1: FBS: Boot Segment Configuration Register
- Register 26-2: FGS: General Segment Configuration Register
- Register 26-3: FOSCSEL: Oscillator Selection Configuration Register
- Register 26-4: FOSC: Oscillator Configuration Register
- Register 26-5: FWDT: Watchdog Timer Configuration Register
- Register 26-6: FPOR: Reset Configuration Register
- Register 26-7: FICD: In-Circuit Debugger Configuration Register
- Register 26-8: FDS: Deep Sleep Configuration Register
- Register 26-9: DEVID: Device ID Register
- Register 26-10: DEVREV: Device Revision Register
- 26.2 On-Chip Voltage Regulator
- 26.3 Watchdog Timer (WDT)
- 26.4 Deep Sleep Watchdog Timer (DSWDT)
- 26.5 Program Verification and Code Protection
- 26.6 In-Circuit Serial Programming
- 26.7 In-Circuit Debugger
- 26.1 Configuration Bits
- 27.0 Development Support
- 27.1 MPLAB X Integrated Development Environment Software
- 27.2 MPLAB XC Compilers
- 27.3 MPASM Assembler
- 27.4 MPLINK Object Linker/ MPLIB Object Librarian
- 27.5 MPLAB Assembler, Linker and Librarian for Various Device Families
- 27.6 MPLAB X SIM Software Simulator
- 27.7 MPLAB REAL ICE In-Circuit Emulator System
- 27.8 MPLAB ICD 3 In-Circuit Debugger System
- 27.9 PICkit 3 In-Circuit Debugger/ Programmer
- 27.10 MPLAB PM3 Device Programmer
- 27.11 Demonstration/Development Boards, Evaluation Kits and Starter Kits
- 27.12 Third-Party Development Tools
- 28.0 Instruction Set Summary
- 29.0 Electrical Characteristics
- Absolute Maximum Ratings(†)
- 29.1 DC Characteristics
- FIGURE 29-1: PIC24FV32KA304 Voltage-Frequency Graph (Industrial and Extended)
- FIGURE 29-2: PIC24F32KA304 Family Voltage-Frequency Graph (Industrial and Extended)
- TABLE 29-1: Thermal Operating Conditions
- TABLE 29-2: Thermal Packaging Characteristics
- TABLE 29-3: DC Characteristics: Temperature and Voltage Specifications
- TABLE 29-4: High/Low–Voltage Detect Characteristics
- TABLE 29-5: BOR Trip Points
- TABLE 29-6: DC Characteristics: Operating Current (Idd)
- TABLE 29-7: DC Characteristics: Idle Current (Iidle)
- TABLE 29-8: DC Characteristics: Power-Down Current (Ipd)
- TABLE 29-9: DC Characteristics: I/O Pin Input Specifications
- TABLE 29-10: DC Characteristics: I/O Pin Output Specifications
- TABLE 29-11: DC Characteristics: Program Memory
- TABLE 29-12: DC Characteristics: Data EEPROM Memory
- TABLE 29-13: DC Characteristics: Comparator Specifications
- TABLE 29-14: DC Characteristics: Comparator Voltage Reference Specifications
- TABLE 29-15: Internal Voltage Regulator Specifications
- TABLE 29-16: CTMU Current Source Specifications
- 29.2 AC Characteristics and Timing Parameters
- TABLE 29-17: Temperature and Voltage Specifications – AC
- FIGURE 29-3: Load Conditions for Device Timing Specifications
- TABLE 29-18: Capacitive Loading Requirements on Output Pins
- FIGURE 29-4: External Clock Timing
- TABLE 29-19: External Clock Timing Requirements
- TABLE 29-20: PLL Clock Timing Specifications
- TABLE 29-21: AC Characteristics: Internal RC Accuracy
- TABLE 29-22: Internal RC Oscillator Specifications
- FIGURE 29-5: CLKO and I/O Timing Characteristics
- TABLE 29-23: CLKO and I/O Timing Requirements
- TABLE 29-24: Comparator Timings
- TABLE 29-25: Comparator Voltage Reference Settling Time Specifications
- FIGURE 29-6: Reset, Watchdog Timer, Oscillator Start-up Timer and Power-up Timer Timing Characteristics
- FIGURE 29-7: Brown-out Reset Characteristics
- TABLE 29-26: Reset, Watchdog Timer, Oscillator Start-up Timer, Power-Up Timer, and Brown-Out Reset Timing Requirements
- FIGURE 29-8: Timer1/2/3/4/5 External Clock Input Timing
- TABLE 29-27: Timer1/2/3/4/5 External Clock Input Requirements
- FIGURE 29-9: Input Capture x Timings
- TABLE 29-28: Input Capture x Requirements
- FIGURE 29-10: Output Compare x Timings
- TABLE 29-29: Output Capture Requirements
- FIGURE 29-11: PWM Module Timing Requirements
- TABLE 29-30: PWM Timing Requirements
- FIGURE 29-12: I2C Bus Start/Stop Bits Timing Characteristics (Master Mode)
- TABLE 29-31: I2C Bus Start/Stop Bit Timing Requirements (Master Mode)
- FIGURE 29-13: I2C Bus Data Timing Characteristics (Master Mode)
- TABLE 29-32: I2C Bus Data Timing Requirements (Master Mode)
- FIGURE 29-14: I2C Bus Data Timing Characteristics (Slave Mode)
- TABLE 29-33: I2C Bus Data Timing Requirements (Slave Mode)
- FIGURE 29-15: I2C Bus Start/Stop Bits Timing Characteristics (Slave Mode)
- TABLE 29-34: I2C Bus Start/Stop Bits Timing Requirements (Slave Mode)
- FIGURE 29-16: UARTx Baud Rate Generator Output Timing
- FIGURE 29-17: UARTx Start Bit Edge Detection
- TABLE 29-35: UARTx Timing Requirements
- FIGURE 29-18: SPIx Module Master Mode Timing Characteristics (CKE = 0)
- TABLE 29-36: SPIx Master Mode Timing Requirements (CKE = 0)
- FIGURE 29-19: SPIx Module Master Mode Timing Characteristics (CKE = 1)
- TABLE 29-37: SPIx Module Master Mode Timing Requirements (CKE = 1)
- FIGURE 29-20: SPIx Module Slave Mode Timing Characteristics (CKE = 0)
- TABLE 29-38: SPIx Module Slave Mode Timing Requirements (CKE = 0)
- FIGURE 29-21: SPIx Module Slave Mode Timing Characteristics (CKE = 1)
- TABLE 29-39: SPIx Module Slave Mode Timing Requirements (CKE = 1)
- TABLE 29-40: A/D Module Specifications
- FIGURE 29-22: A/D Conversion Timing
- TABLE 29-41: A/D Conversion Timing Requirements(1)
- 30.0 DC and AC Characteristics Graphs and Tables
- 30.1 Characteristics for Industrial Temperature Devices (-40°C to +85°C)
- FIGURE 30-1: Typical and Maximum Idd vs. Fosc (EC Mode, 2 MHz to 32 MHz, -40°C to +85°C)
- FIGURE 30-2: Typical and Maximum Idd vs. Fosc (EC Mode, 1.95 kHz to 1 MHz, +25°C)
- FIGURE 30-3: Typical and Maximum Iidle vs. Frequency (EC Mode, 2 MHz to 32 MHz)
- FIGURE 30-4: Typical and Maximum Iidle vs. Frequency (EC Mode, 1.95 kHz to 1 MHz)
- FIGURE 30-5: Typical Idd vs. Vdd (8 MHz, EC Mode)
- FIGURE 30-6: Typical Idd vs. Vdd (FRC Mode)
- FIGURE 30-7: Typical and Maximum Idd vs. Temperature (FRC Mode)
- FIGURE 30-8: Typical and Maximum Iidle vs. Vdd (FRC Mode)
- FIGURE 30-9: Typical and Maximum Iidle vs. Temperature (FRC Mode)
- FIGURE 30-10: FRC Frequency Accuracy vs. Vdd
- FIGURE 30-11: FRC Frequency Accuracy vs. Temperature (2.0V £ Vdd £ 5.5V)
- FIGURE 30-12: LPRC Frequency Accuracy vs. Vdd
- FIGURE 30-13: LPRC Frequency Accuracy vs. Temperature (2.0V £ Vdd £ 5.5V)
- FIGURE 30-14: Typical and Maximum Ipd vs. Vdd
- FIGURE 30-15: Typical and Maximum Ipd vs. Temperature
- FIGURE 30-16: Typical and Maximum Ipd vs. Vdd (Deep Sleep Mode)
- FIGURE 30-17: Typical and Maximum Ipd vs. Temperature (Deep Sleep Mode)
- FIGURE 30-18: Typical DIbor vs. Vdd
- FIGURE 30-19: Typical DIwdt vs. Vdd
- FIGURE 30-20: Typical DIdsbor vs. Vdd
- FIGURE 30-21: Typical DIhlvd vs. Vdd
- FIGURE 30-22: Typical DIdswdt vs. Vdd
- FIGURE 30-23: Typical Vbor vs. Temperature (BOR Trip Point 3)
- FIGURE 30-24: Typical Voh vs. Ioh (General Purpose I/O, as a Function of Vdd)
- FIGURE 30-25: Typical Voh vs. Ioh (General Purpose I/O, as a Function of Temperature, 2.0V £ Vdd £ 5.5V)
- FIGURE 30-26: Typical Vol vs. Iol (General Purpose I/O, as a Function of Vdd)
- FIGURE 30-27: Typical Vol vs. Iol (General Purpose I/O, as a Function of Temperature, 2.0V £ Vdd £ 5.5V)
- FIGURE 30-28: Vil/Vih vs. Vdd (General Purpose I/O, Temperatures as Noted)
- FIGURE 30-29: Vil/Vih vs. Vdd (I2C, Temperatures as Noted)
- FIGURE 30-30: Vil/Vih vs. Vdd (OSCO, Temperatures as Noted)
- FIGURE 30-31: Vil/Vih vs. Vdd (MCLR, Temperatures as Noted)
- FIGURE 30-32: Typical Band Gap Voltage vs. Vdd
- FIGURE 30-33: Typical Band Gap Voltage vs. Temperature (2.0V £ Vdd £ 5.5V)
- FIGURE 30-34: Typical Voltage Regulator Output vs. Vdd
- FIGURE 30-35: Typical Voltage Regulator Output vs. Temperature
- FIGURE 30-36: HLVD Trip Point Voltage vs. Temperature (HLVDL<3:0> = 0000, PIC24F32KA304 Family Devices ONLY
- FIGURE 30-37: Temperature Sensor Diode Voltage vs. Temperature (2.0V £ Vdd £ 5.5V)
- FIGURE 30-38: CTMU Output Current vs. Temperature (IRNG<1:0> = 01, 2.0V £ Vdd £ 5.5V)
- FIGURE 30-39: CTMU Output Current vs. Vdd (IRNG<1:0> = 01)
- 30.2 Characteristics for Extended Temperature Devices (-40°C to +125°C)
- FIGURE 30-40: Typical and Maximum Iidle vs. Vdd (FRC Mode)
- FIGURE 30-41: Typical and Maximum Iidle vs. Temperature (FRC Mode)
- FIGURE 30-42: Typical and Maximum Ipd vs. Vdd
- FIGURE 30-43: Typical and Maximum Ipd vs. Temperature
- FIGURE 30-44: Typical and Maximum Ipd vs. Vdd (Deep Sleep Mode)
- FIGURE 30-45: Typical and Maximum Ipd vs. Temperature (Deep Sleep Mode)
- FIGURE 30-46: Typical DIwdt vs. Vdd
- FIGURE 30-47: Typical DIdsbor vs. Vdd
- FIGURE 30-48: Typical DIhlvd vs. Vdd
- FIGURE 30-49: Typical Vol vs. Iol (General I/O, 2.0V £ Vdd £ 5.5V)
- FIGURE 30-50: Typical Voh vs. Ioh (General I/O, as a Function of Temperature, 2.0V £ Vdd £ 5.5V)
- FIGURE 30-51: Vil/Vih vs. Vdd (General Purpose I/O, Temperatures as Noted)
- FIGURE 30-52: Vil/Vih vs. Vdd (I2C, Temperatures as Noted)
- FIGURE 30-53: Vil/Vih vs. Vdd (OSCO, Temperatures as Noted)
- FIGURE 30-54: Vil/Vih vs. Vdd (MCLR, Temperatures as Noted)
- FIGURE 30-55: Typical Band Gap Voltage vs. Temperature (2.0V £ Vdd £ 5.5V)
- FIGURE 30-56: Typical Voltage Regulator Output vs. Temperature
- 30.1 Characteristics for Industrial Temperature Devices (-40°C to +85°C)
- 31.0 Packaging Information
- Appendix A: Revision History
- INDEX
- The Microchip Web Site
- Customer Change Notification Service
- Customer Support
- Product Identification System
- Worldwide Sales and Service

PIC24FV32KA304 FAMILY
DS30009995E-page 26 2011-2017 Microchip Technology Inc.
2.4.1 CONSIDERATIONS FOR CERAMIC
CAPACITORS
In recent years, large value, low-voltage, surface-mount
ceramic capacitors have become very cost effective in
sizes up to a few tens of microfarad. The low-ESR, small
physical size and other properties make ceramic
capacitors very attractive in many types of applications.
Ceramic capacitors are suitable for use with the inter-
nal Voltage Regulator of this microcontroller. However,
some care is needed in selecting the capacitor to
ensure that it maintains sufficient capacitance over the
intended operating range of the application.
Typical low-cost, 10 F ceramic capacitors are available
in X5R, X7R and Y5V dielectric ratings (other types are
also available, but are less common). The initial toler-
ance specifications for these types of capacitors are
often specified as ±10% to ±20% (X5R and X7R), or
-20%/+80% (Y5V). However, the effective capacitance
that these capacitors provide in an application circuit will
also vary based on additional factors, such as the
applied DC bias voltage and the temperature. The total
in-circuit tolerance is, therefore, much wider than the
initial tolerance specification.
The X5R and X7R capacitors typically exhibit satisfac-
tory temperature stability (ex: ±15% over a wide
temperature range, but consult the manufacturer’s data
sheets for exact specifications). However, Y5V capaci-
tors typically have extreme temperature tolerance
specifications of +22%/-82%. Due to the extreme
temperature tolerance, a 10 F nominal rated Y5V type
capacitor may not deliver enough total capacitance to
meet minimum internal Voltage Regulator stability and
transient response requirements. Therefore, Y5V
capacitors are not recommended for use with the
internal regulator if the application must operate over a
wide temperature range.
In addition to temperature tolerance, the effective
capacitance of large value ceramic capacitors can vary
substantially, based on the amount of DC voltage
applied to the capacitor. This effect can be very signifi-
cant, but is often overlooked or is not always
documented.
A typical DC bias voltage vs. capacitance graph for
X7R type capacitors is shown in Figure 2-4.
FIGURE 2-4: DC BIAS VOLTAGE vs.
CAPACITANCE
CHARACTERISTICS
When selecting a ceramic capacitor to be used with the
internal Voltage Regulator, it is suggested to select a
high-voltage rating, so that the operating voltage is a
small percentage of the maximum rated capacitor volt-
age. For example, choose a ceramic capacitor rated at
16V for the 3.3V or 2.5V core voltage. Suggested
capacitors are shown in Table 2-1.
2.5 ICSP Pins
The PGC and PGD pins are used for In-Circuit Serial
Programming™ (ICSP™) and debugging purposes. It
is recommended to keep the trace length between the
ICSP connector and the ICSP pins on the device as
short as possible. If the ICSP connector is expected to
experience an ESD event, a series resistor is recom-
mended, with the value in the range of a few tens of
ohms, not to exceed 100Ω.
Pull-up resistors, series diodes and capacitors on the
PGC and PGD pins are not recommended as they will
interfere with the programmer/debugger communica-
tions to the device. If such discrete components are an
application requirement, they should be removed from
the circuit during programming and debugging. Alter-
natively, refer to the AC/DC characteristics and timing
requirements information in the respective device
Flash programming specification for information on
capacitive loading limits, and Voltage Input High (V
IH
)
pin and Voltage Input Low (V
IL
) pin requirements.
For device emulation, ensure that the “Communication
Channel Select” (i.e., PGCx/PGDx pins), programmed
into the device, matches the physical connections for
the ICSP to the Microchip debugger/emulator tool.
For more information on available Microchip
development tools connection requirements, refer to
Section 27.0 “Development Support”.
-80
-70
-60
-50
-40
-30
-20
-10
0
10
5 1011121314151617
DC Bias Voltage (VDC)
Capacitance Change (%)
01234 67 89
16V Capacitor
10V Capacitor
6.3V Capacitor