Datasheet

 2007-2019 Microchip Technology Inc. DS30009905F-page 309
PIC24FJ256GA110 FAMILY
RECOMMENDED LAND PATTERN
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Dimension Limits
Units
C1Contact Pad Spacing
Contact Pad Spacing
Contact Pitch
C2
MILLIMETERS
0.50 BSC
MIN
E
MAX
11.40
11.40
Contact Pad Length (X28)
Contact Pad Width (X28)
Y1
X1
1.50
0.30
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
Microchip Technology Drawing C04-2085B Sheet 1 of 1
GDistance Between Pads 0.20
NOM
64-Lead Plastic Thin Quad Flatpack (PT)-10x10x1 mm Body, 2.00 mm Footprint [TQFP]
C2
C1
E
G
Y1
X1