Datasheet

PIC18F2XK20/4XK20
DS40001303H-page 434  2010-2015 Microchip Technology Inc.
RECOMMENDED LAND PATTERN
44-Lead Plastic Thin Quad Flatpack (PT) - 10X10X1 mm Body, 2.00 mm Footprint [TQFP]
SILK SCREEN
1
2
44
C1
E
G
Y1
X1
C2
Contact Pad Width (X44)
0.25
Contact Pad Length (X44)
Distance Between Pads
X1
Y1
G
1.50
Contact Pad Spacing
Contact Pitch
C1
E
Units
Dimension Limits
11.40
0.55
0.80 BSC
MILLIMETERS
MAXMIN NOM
11.40C2Contact Pad Spacing
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
1. Dimensioning and tolerancing per ASME Y14.5M
Notes:
Microchip Technology Drawing No. C04-2076B
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note: