Datasheet
2010-2015 Microchip Technology Inc. DS40001303H-page 365
PIC18F2XK20/4XK20
TABLE 26-15: THERMAL CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Param.
No.
Sym. Characteristic Typ. Units Conditions
TH01 JA Thermal Resistance Junction to
Ambient
60.0 C/W 28-pin SPDIP package
80.3 C/W 28-pin SOIC package
90.0 C/W 28-pin SSOP package
36.0 C/W 28-pin QFN 6x6 mm package
48.0 C/W 28-pin UQFN 4x4 mm package
47.2 C/W 40-pin PDIP package
46.0 C/W 44-pin TQFP package
24.4 C/W 44-pin QFN package
41.0 C/W 40-pin UQFN 5x5 mm package
TH02 JC Thermal Resistance Junction to
Case
31.4 C/W 28-pin SPDIP package
24.0 C/W 28-pin SOIC package
24.0 C/W 28-pin SSOP package
6.0 C/W 28-pin QFN 6x6 mm package
12.0 C/W 28-pin UQFN 4x4 mm package
24.7 C/W 40-pin PDIP package
14.5 C/W 44-pin TQFP package
20.0 C/W 44-pin QFN package
50.5 C/W 40-pin UQFN 5x5 mm package
TH03 T
JMAX Maximum Junction Temperature 150 C—
TH04 PD Power Dissipation — W PD = PINTERNAL + PI/O
TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD X VDD
(1)
TH06 PI/O I/O Power Dissipation — W PI/O =(IOL * VOL) + (IOH * (VDD - VOH))
TH07 PDER Derated Power — W PDER = PDMAX (TJ - TA)/JA
(2)
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
2: T
A = Ambient Temperature, TJ = Junction Temperature