Datasheet

 2010-2016 Microchip Technology Inc. DS40001412G-page 529
PIC18(L)F2X/4XK22
Microchip Technology Drawing C04-103D Sheet 2 of 2
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Number of Pins
Overall Height
Terminal Width
Overall Width
Overall Length
Terminal Length
Exposed Pad Width
Exposed Pad Length
Terminal Thickness
Pitch
Standoff
Units
Dimension Limits
A1
A
b
D
E2
D2
A3
e
L
E
N
0.65 BSC
0.20 REF
6.25
6.25
0.30
0.20
0.80
0.00
0.30
8.00 BSC
0.40
6.45
6.45
0.90
0.02
8.00 BSC
MILLIMETERS
MIN
NOM
44
6.60
6.60
0.50
0.35
1.00
0.05
MAX
K-0.20 -
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
1.
2.
3.
Notes:
Pin 1 visual index feature may vary, but must be located within the hatched area.
Package is saw singulated
Dimensioning and tolerancing per ASME Y14.5M
Terminal-to-Exposed-Pad
44-Lead Plastic Quad Flat, No Lead Package (ML) - 8x8 mm Body [QFN or VQFN]