Datasheet

 2010-2015 Microchip Technology Inc. DS40001303H-page 433
PIC18F2XK20/4XK20
Microchip Technology Drawing C04-076C Sheet 2 of 2
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
L
(L1)
c
θ
SECTION A-A
H
Number of Leads
Overall Height
Lead Width
Overall Width
Overall Length
Lead Length
Molded Package Width
Molded Package Length
Molded Package Thickness
Lead Pitch
Standoff
Units
Dimension Limits
A1
A
b
D
E1
D1
A2
e
L
E
N
0.80 BSC
0.45
0.30
-
0.05
0.37
12.00 BSC
0.60
10.00 BSC
10.00 BSC
-
-
12.00 BSC
MILLIMETERS
MIN
NOM
44
0.75
0.45
1.20
0.15
MAX
0.95 1.00 1.05
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
1.
2.
3.
Notes:
Pin 1 visual index feature may vary, but must be located within the hatched area.
Exact shape of each corner is optional.
Dimensioning and tolerancing per ASME Y14.5M
Footprint L1 1.00 REF
θ 3.5°0° 7°Foot Angle
Lead Thickness
c
0.09 - 0.20
44-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1.0 mm Body [TQFP]