Datasheet

PIC18F2XK20/4XK20
DS40001303H-page 350  2010-2015 Microchip Technology Inc.
26.0 ELECTRICAL SPECIFICATIONS
26.1 Absolute Maximum Ratings
(†)
Ambient temperature under bias.............................................................................................................-40°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on pins with respect to V
SS (except VDD, and MCLR)........................................................-0.3V to (VDD + 0.3V)
on V
DD pin .............................................................................................................................. -0.3V to +4.5V
on MCLR
(2)
................................................................................................................................. 0V to +11.0V
Total power dissipation
(1)
..........................................................................................................................................1.0W
Maximum current
PIC18F2XK20/4XK20
out of V
SS pin, -40°C to +85°C for industrial ...................................................................................... 350 mA
out of V
SS pin, +85°C to +125°C for extended................................................................................... 120 mA
PIC18F4XK20
into V
DD pin, -40°C to +85°C for industrial ......................................................................................... 350mA
into V
DD pin, +85°C to +125°C for extended.......................................................................................120 mA
PIC18F2XK20
into V
DD pin, -40°C to +85°C for industrial ......................................................................................... 250mA
into V
DD pin, +85°C to +125°C for extended.........................................................................................85 mA
Input clamp current, I
IK (VI < 0 or VI > VDD)20 mA
Maximum output current
sunk by any I/O pin ...............................................................................................................................50 mA
sourced by any I/O pin ..........................................................................................................................50 mA
Note 1: Power dissipation is calculated as follows: P
DIS = VDD x {IDD –  IOH} +  {(VDD – VOH) x IOH} + (VOL x IOL).
2: Voltage spikes below V
SS at the MCLR/VPP/RE3 pin, inducing currents greater than 80 mA, may cause
latch-up. Thus, a series resistor of 50-100 should be used when applying a “low” level to the
MCLR/VPP/RE3 pin, rather than pulling this pin directly to VSS.
3: Maximum current rating requires even load distribution across I/O pins. Maximum current rating may be
limited by the device package power dissipation characterizations. See Table 26-15 to calculate device
specifications.
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for
extended periods may affect device reliability.