Datasheet

 2010 Microchip Technology Inc. Preliminary DS41412C-page 463
PIC18(L)F2X/4XK22
29.0 PACKAGING INFORMATION
29.1 Package Marking Information
28-Lead SOIC (300 mil)
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
YYWWNNN
Example
PIC18F25K22-E/SO
0810017
28-Lead SPDIP (300 mil)
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
YYWWNNN
Example
PIC18F25K22-E/SP
0810017
Legend: XX...X Customer-specific information or Microchip part number
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
* This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
3
e
3
e
Example
PIC18F25K22
0810017
3
e
-E/SS
28-Lead SSOP
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
XXXXXXXX
28-Lead QFN (6mm x 6mm)
XXXXXXXX
YYWWNNN
18F25K22
Example
-I/ML
0610017