Datasheet

PIC18(L)F2X/4XK22
DS41412C-page 426 Preliminary  2010 Microchip Technology Inc.
D017 DAC
12 20 20 A
1.8V
20 30 30 A
3.0V
12 20 20 A
1.8V
20 30 30 A
3.0V
33 50 50 A
5.0V
D018 FVR
15 25 25 A
1.8V
15 25 25 A
3.0V
30 45 45 A
1.8V
35 55 55 A
3.0V
70 100 100 A
5.0V
27.2 DC Characteristics: Power-Down Current, PIC18(L)F2X/4XK22 (Continued)
PIC18LF2X/4XK22
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  T
A  +125°C
PIC18F2X/4XK22
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  T
A  +125°C
Param
No.
Device Characteristics
Typ
+25°C
Typ
+60°C
Max
+85°C
Max
+125°C
Units
Conditions
V
DD Notes
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
DD or VSS
and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: BOR, HLVD and FVR enable internal band gap reference. With both modules enabled, current consump-
tion will be less than the sum of both specifications.
3: A/D converter differential currents apply only in Run mode. In Sleep or Idle mode both the ADC and the
FRC turn off as soon as conversion (if any) is complete.