Datasheet
2010 Microchip Technology Inc. Preliminary DS41412C-page 425
PIC18(L)F2X/4XK22
D011 Secondary Oscillator
0.8 3 3 A
1.8V
32 kHz on SOSC
0.9 4 4 A
3.0V
0.8 3 3 A
1.8V
0.9 4 4 A
3.0V
1 5 5 A
5.0V
D013 A/D Converter
(3)
200 A
1.8V
A/D on, not converting
260 A
3.0V
200 A
1.8V
260 A
3.0V
260 A
5.0V
D014 A/D Converter
(3)
A
1.8V
Adder to A/D current for
FRC conversion clock.
A
3.0V
A
1.8V
A
3.0V
A
5.0V
D015 Comparators
91515A
1.8V
LP mode
91515A
3.0V
9 15 15 A
1.8V
9 15 15 A
3.0V
9 15 15 A
5.0V
D16 Comparators
50 80 80 A
1.8V
HP mode
50 80 80 A
3.0V
50 80 80 A
1.8V
50 80 80 A
3.0V
50 80 80 A
5.0V
27.2 DC Characteristics: Power-Down Current, PIC18(L)F2X/4XK22 (Continued)
PIC18LF2X/4XK22
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +125°C
PIC18F2X/4XK22
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +125°C
Param
No.
Device Characteristics
Typ
+25°C
Typ
+60°C
Max
+85°C
Max
+125°C
Units
Conditions
V
DD Notes
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
DD or VSS
and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: BOR, HLVD and FVR enable internal band gap reference. With both modules enabled, current consump-
tion will be less than the sum of both specifications.
3: A/D converter differential currents apply only in Run mode. In Sleep or Idle mode both the ADC and the
FRC turn off as soon as conversion (if any) is complete.