Datasheet

PIC18(L)F1XK22
DS40001365F-page 4  2009-2016 Microchip Technology Inc.
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 6
2.0 Oscillator Module........................................................................................................................................................................ 12
3.0 Memory Organization ................................................................................................................................................................. 24
4.0 Flash Program Memory.............................................................................................................................................................. 45
5.0 Data EEPROM Memory ............................................................................................................................................................. 54
6.0 8 x 8 Hardware Multiplier............................................................................................................................................................ 58
7.0 Interrupts .................................................................................................................................................................................... 60
8.0 I/O Ports ..................................................................................................................................................................................... 73
9.0 Timer0 Module ........................................................................................................................................................................... 91
10.0 Timer1 Module ........................................................................................................................................................................... 94
11.0 Timer2 Module ......................................................................................................................................................................... 100
12.0 Timer3 Module ......................................................................................................................................................................... 102
13.0 Enhanced Capture/Compare/PWM (ECCP) Module................................................................................................................ 106
14.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 127
15.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................................... 170
16.0 Analog-to-Digital Converter (ADC) Module .............................................................................................................................. 197
17.0 Comparator Module.................................................................................................................................................................. 210
18.0 Power-Managed Modes ........................................................................................................................................................... 222
19.0 SR Latch................................................................................................................................................................................... 228
20.0 Fixed Voltage Reference (FVR)................................................................................................................................................ 231
21.0 Digital-to-Analog Converter (DAC) Module .............................................................................................................................. 233
22.0 Reset ........................................................................................................................................................................................ 237
23.0 Special Features of the CPU.................................................................................................................................................... 249
24.0 Instruction Set Summary .......................................................................................................................................................... 265
25.0 Development Support............................................................................................................................................................... 315
26.0 Electrical Specifications............................................................................................................................................................ 319
27.0 DC and AC Characteristics Graphs and Charts ....................................................................................................................... 356
28.0 Packaging Information.............................................................................................................................................................. 372
Appendix A: Revision History............................................................................................................................................................. 382
Appendix B: Device Differences......................................................................................................................................................... 383
The Microchip WebSite...................................................................................................................................................................... 384
Customer Change Notification Service .............................................................................................................................................. 384
Customer Support .............................................................................................................................................................................. 384
Product Identification System............................................................................................................................................................. 385
Worldwide Sales and Service ............................................................................................................................................................ 387