Datasheet

 2009-2016 Microchip Technology Inc. DS40001365F-page 319
PIC18(L)F1XK22
26.0 ELECTRICAL SPECIFICATIONS
26.1 Absolute Maximum Ratings
(†)
Ambient temperature under bias...................................................................................................... -40°C to +125°C
Storage temperature ........................................................................................................................ -65°C to +150°C
Voltage on pins with respect to VSS
on VDD pin
PIC18F1XK22 ........................................................................................................... -0.3V to +6.5V
PIC18LF1XK22 ......................................................................................................... -0.3V to +4.0V
on MCLR
pin ........................................................................................................................... -0.3V to +9.0V
on all other pins ............................................................................................................ -0.3V to (V
DD + 0.3V)
Maximum current
(1)
on VSS pin
-40°C  T
A  +85°C, Industrial ............................................................................................. 250 mA
-40°C  T
A  +125°C, Extended ............................................................................................. 85 mA
on V
DD pin
-40°C  T
A  +85°C,Industrial .............................................................................................. 250 mA
-40°C  T
A  +125°C, Extended ............................................................................................. 85 mA
sunk by all ports................................................................................................................................... 250 mA
sourced by all ports ............................................................................................................................. 250 mA
Maximum output current
sunk by any I/O pin.............................................................................................................................. 50 mA
sourced by any I/O pin ....................................................................................................................... 50 mA
Clamp current, IK (VPIN < 0 or VPIN > VDD) ................................................................................................... 20 mA
Total power dissipation
(2)
............................................................................................................................... 800 mW
Note 1: Maximum current rating requires even load distribution across I/O pins. Maximum current rating may be
limited by the device package power dissipation characterizations, see Tab le 26- 8 to calculate device
specifications.
2: Power dissipation is calculated as follows:
P
DIS = VDD x {IDD – ΣIOH} + Σ{VDD – VOH) x IOH} + Σ(VOL x IOI).
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for
extended periods may affect device reliability.