Datasheet

 2005 Microchip Technology Inc. DS30487C-page 211
PIC16F87/88
28-Lead Plastic Quad Flat No Lead Package (ML) 6x6 mm Body, Punch Singulated (QFN)
Lead Width
*Controlling Parameter
Drawing No. C04-114
Notes:
Mold Draft Angle Top
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
B
ı
α
.009
12°
.011 .014 0.23
12°
0.28 0.35
Pitch
Number of Pins
Overall Width
Standoff
Molded Package Length
Overall Length
Molded Package Width
Molded Package Thickness
Overall Height
MAX
Units
Dimension Limits
A2
A1
E1
D
D1
E
n
p
A
.026
.236 BSC
.000
.226 BSC
INCHES
.026 BSC
MIN
28
NOM MAX
0.65
.031
.002 0.00
6.00 BSC
5.75 BSC
MILLIMETERS*
.039
MIN
28
0.65 BSC
NOM
0.80
0.05
1.00
.008 REFBase Thickness
A3
0.20 REF
JEDEC equivalent: MO-220
0.85.033
.0004 0.01
.236 BSC
.226 BSC
6.00 BSC
5.75 BSC
Lead Length
Tie Bar Width
L . 020 . 024 .030 0.50 0.60 0.75
R . 005 . 007 .010 0.13 0.17 0.23
Tie Bar Length
Q
.012 .016 .026 0.30 0.40 0.65
Chamfer CH . 009 . 017 .024 0.24 0.42 0.60
E2
D2
Exposed Pad Width
Exposed Pad Length
.140 .146 .152 3.55 3.70 3.85
.140 .146 .152 3.55 3.70 3.85
D
E
E1
n
1
2
D1
A
A2
EXPOSED
METAL
PAD
BOTTOM VIEW
TOP VIEW
Q
L
R
p
A1
A3
ı
CH X 45°
B
D2
E2
α