Datasheet

PIC16(L)F1938/9
DS40001574D-page 452  2011-2017 Microchip Technology Inc.
Note: Custom package option requires Microchip approval and a minimum order quantity.
RECOMMENDED LAND PATTERN
Dimension Limits
Units
C2
Optional Center Pad Width
Contact Pad Spacing
Optional Center Pad Length
Contact Pitch
Y2
X2
2.75
2.75
MILLIMETERS
0.40 BSC
MIN
E
MAX
4.00
Contact Pad Length (X28)
Contact Pad Width (X28)
Y1
X1
0.80
0.20
NOM
C1Contact Pad Spacing 4.00
Contact Pad to Center Pad (X28) G1 0.23
Thermal Via Diameter V
Thermal Via Pitch EV
0.30
1.00
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Microchip Technology Drawing C04-2456 Rev A
28-Lead Very Thin Plastic Quad Flat, No Lead (STX) - 4x4 mm Body [VQFN]
C1
C2
EV
Y2
X2
EV
E
X1
Y1
G1
G2
ØV
SILK SCREEN
Contact Pad to Contact Pad (X24) G2 0.20
With 2.65x2.65 mm Exposed Pad