Datasheet
2011-2017 Microchip Technology Inc. DS40001574D-page 451
PIC16(L)F1938/9
Note: Custom package option requires Microchip approval and a minimum order quantity.
Microchip Technology Drawing C04-456 Rev A Sheet 2 of 2
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
1.
2.
3.
Notes:
Pin 1 visual index feature may vary, but must be located within the hatched area.
Package is saw singulated
Dimensioning and tolerancing per ASME Y14.5M
28-Lead Very Thin Plastic Quad Flat, No Lead (STX) - 4x4 mm Body [VQFN]
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Number of Terminals
Overall Height
Terminal Width
Overall Width
Terminal Length
Exposed Pad Width
Terminal Thickness
Pitch
Standoff
Units
Dimension Limits
A1
A
b
E2
A3
e
L
E
N
0.40 BSC
0.127 REF
2.55
0.30
0.15
0.80
0.00
0.20
0.40
2.65
0.90
0.02
4.00 BSC
MILLIMETERS
MIN
NOM
28
2.75
0.50
0.25
1.00
0.05
MAX
K 0.275 REFTerminal-to-Exposed-Pad
Overall Length
Exposed Pad Length
D
D2 2.55
4.00 BSC
2.65 2.75
CH 0.25Exposed Pad Corner Chamfer - -
With 2.65x2.65 mm Exposed Pad