Datasheet

 2010-2015 Microchip Technology Inc. DS40001419F-page 435
PIC16(L)F1824/8
RECOMMENDED LAND PATTERN
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Dimension Limits
Units
C2
Optional Center Pad Width
Contact Pad Spacing
Optional Center Pad Length
Contact Pitch
Y2
X2
2.80
2.80
MILLIMETERS
0.50 BSC
MIN
E
MAX
4.00
Contact Pad Length (X20)
Contact Pad Width (X20)
Y1
X1
0.80
0.30
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
Microchip Technology Drawing C04-2255A
NOM
20-Lead Ultra Thin Plastic Quad Flat, No Lead Package (GZ) - 4x4x0.5 mm Body [UQFN]
SILK SCREEN
1
2
20
C1
C2
E
X1
Y1
G1
Y2
X2
C1Contact Pad Spacing 4.00
Contact Pad to Center Pad (X20) G1 0.20