Datasheet

PIC16(L)F1824/8
DS40001419F-page 424  2010-2015 Microchip Technology Inc.
RECOMMENDED LAND PATTERN
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
SILK SCREEN
Dimension Limits
Units
C2
Optional Center Pad Width
Contact Pad Spacing
Optional Center Pad Length
Contact Pitch
Y2
X2
2.70
2.70
MILLIMETERS
0.65 BSC
MIN
E
MAX
4.00
Contact Pad Length (X16)
Contact Pad Width (X16)
Y1
X1
0.80
0.35
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
Microchip Technology Drawing C04-2257A
NOM
16-Lead Ultra Thin Plastic Quad Flat, No Lead Package (JQ) - 4x4x0.5 mm Body
C2
C1
X2
Y2
X1
E
Y1
C1 4.00Contact Pad Spacing
1
2
16
[UQFN]